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參數(shù)資料
| 型號： | pentium III processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit Processor Mobile Module(32 位帶移動模塊處理器) |
| 中文描述： | 32位處理器的移動模塊（32位帶移動模塊處理器） |
| 文件頁數(shù)： | 4/67頁 |
| 文件大小： | 834K |
| 代理商： | PENTIUM III PROCESSOR |
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Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep
Technology
iv
Datasheet
243356-005
5.3.1
5.3.2
5.3.3
5.3.4
Voltage Regulator Efficiency..................................................................34
Voltage Regulator Control......................................................................36
Power Planes: Bulk Capacitance Requirements....................................38
System Power Supply Circuit Protection................................................40
5.3.4.1 DC Power System Protection....................................................40
5.3.4.2 V_DC Power Supply..................................................................41
5.3.4.3 Overcurrent Protection..............................................................41
5.3.4.4 Current Limit Shift Point ............................................................43
5.3.4.5 Slew Rate Control .....................................................................45
5.3.4.6 Undervoltage Lockout ...............................................................47
5.3.4.7 Overvoltage Lockout .................................................................48
Active Thermal Feedback ...................................................................................52
Thermal Sensor Configuration Register..............................................................52
5.4
5.5
6.0
Mechanical Specifications................................................................................................53
6.1
Mobile Module Dimensions.................................................................................53
6.1.1
Pin 1 Location of the MMC-2 Connector................................................53
6.1.2
Printed Circuit Board..............................................................................54
6.1.3
Height Restrictions.................................................................................55
6.2
Thermal Transfer Plate .......................................................................................55
6.3
Mobile Module Physical Support.........................................................................57
6.3.1
Mobile Module Mounting Requirements.................................................57
6.3.2
Weight....................................................................................................58
7.0
Thermal Specification.......................................................................................................59
7.1
Thermal Design Power........................................................................................59
8.0
Labeling Information.........................................................................................................60
9.0
Environmental Standards.................................................................................................62
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Block Diagram......................................................................................................4
MMC-2 Connector Pad Footprint ........................................................................20
Clock Control States ...........................................................................................25
BCLK Waveform at the Processor Core Pins .....................................................32
VR Efficiency Chart for Vcore at 1.60V ..............................................................35
VR Efficiency Chart for Vcore at 1.35V...............................................................35
Power Sequence Timing.....................................................................................38
V_DC RMS Ripple Current .................................................................................40
V_DC Power System Protection Block Diagram.................................................41
Overcurrent Protection Circuit.............................................................................42
Current Shift Model.............................................................................................43
Undervoltage Lockout .........................................................................................47
Undervoltage Lockout Model ..............................................................................48
Overvoltage Lockout ...........................................................................................49
Overvoltage Lockout Model ................................................................................49
Recommended Power Supply Protection Circuit for the System Electronics .....51
Simulation of V_DC Voltage Skew......................................................................51
Board Dimensions and MMC-2 Connector Orientation.......................................53
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