Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep
Technology
54
Datasheet
243356-005
6.1.3
Height Restrictions
Figure 21
shows the height restrictions of the mobile module. The keep-out zone is also illustrated.
Three mating connectors are available in heights of approximately 4 mm, 6 mm, and 8 mm. The
three sizes provide flexibility in choosing the system electronics components between the two
boards. Information on these connectors can be obtained from your Intel Field Representative.
Figure 21. Height Restrictions
6.2
Thermal Transfer Plate
The TTPs provide heat dissipation on the processor and the 82443BX, and they may vary on
different generations of Intel mobile modules. The TTPs provide the thermal attach point where a
system manufacturer can transfer heat through the notebook system using a heat pipe, a heat
spreader plate, or a thermal solution. Attachment dimensions for the thermal interface block to the
TTPs are provided in
Figure 22
,
Figure 23
, and
Figure 24
. The TTP on the mobile module is
designed to be a high efficiency spreader. To fully take advantage of the mobile module thermal
design and optimize the system thermal performance, the contact area (Ac) needs to be a minimum
of 30 mm x 30 mm. While it crucial to maximize the contact area, it is equally important to ensure
that the contact area and/or the mobile module is free from warpage in an assembled configuration.
Warning:
If warpage occurs, the thermal resistance of the mobile module could be adversely affected.
When attaching a mating block to either of the TTPs, Intel recommends that a thermal elastomer
should be used as an interface material. This material reduces the thermal resistance. The OEM
thermal interface block should be secured to the CPU TTP with M2 screws using a maximum
torque of 1.5 Kg*cm to 2.0 Kg*cm (equivalent to 0.147 N*m to.197 N*m). The thread length of
the M2 screws should be 2.25-mm gageable thread (2.25-mm minimum to 2.80-mm maximum).
Note 3
Note 3
NOTES:
1.
2.
All values are nominal unless otherwise specified.
3D CAD model (PRO/E Native) Available upon
request.
These dimensions have changed.
3.