參數(shù)資料
型號(hào): pentium III processor
廠商: Intel Corp.
英文描述: 32 bit Processor Mobile Module(32 位帶移動(dòng)模塊處理器)
中文描述: 32位處理器的移動(dòng)模塊(32位帶移動(dòng)模塊處理器)
文件頁數(shù): 64/67頁
文件大?。?/td> 834K
代理商: PENTIUM III PROCESSOR
Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep
Technology
58
Datasheet
243356-005
7.0
Thermal Specification
7.1
Thermal Design Power
Table 30
provides the typical thermal design power (TDP) specifications. The typical TDP is the
typical power dissipation under normal operating conditions at nominal V_CORE (CPU power
supply) while executing the worst case power instruction mix. This includes the power dissipated
by all of the relevant components. During all operating environments, the processor junction
temperature, Tj, must be within the specified range of 0
°
C to 100
°
C.
The power handling capability of the system thermal solution may be reduced to less than the
recommended typical TDP with the implementation of firmware/software control or "throttling”
that reduces the CPU power consumption and dissipation.
NOTES:
1. The processor temperature, T
, must be within the special range of 0
°
C to
100
°
C.
2. TDP
is a thermal-solution design reference point for the system thermal solution readiness for total
module power.
Table 30. Thermal Design Power (TDP
MODULE
) Specification
Typical
750/600 MHz
Typical
700/550 MHz
Typical
650/500 MHz
Typical
600/500 MHz
Notes
1.60V
1.35V
1.60V
1.35V
1.60V
1.35V
1.60V
1.35V
20.0W
13.9W
19.1W
13.4W
17.8W
12.2W
16.6W
12.2W
Module = Core + 82443BX
+ VR
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