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| 型號： | pentium III processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit Processor Mobile Module(32 位帶移動模塊處理器) |
| 中文描述： | 32位處理器的移動模塊（32位帶移動模塊處理器） |
| 文件頁數(shù)： | 44/67頁 |
| 文件大小： | 834K |
| 代理商： | PENTIUM III PROCESSOR |
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Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep
Technology
38
Datasheet
243356-005
Table 27. Bulk Capacitance Requirements per Power Plane
NOTES:
1. Placement of the above capacitance requirements should be located near the connector.
2. V_CLK filtering should be located next to the system clock synthesizer.
3. RMS ripple current specification depends on V_DC input for the module. See
Figure 8
.
4. If Tantalum* capacitors are used, a 50% voltage derating practice must be observed. For example, a 5.0-V
rail requires a 10.0-V rated capacitor.
5. In order to reduce ESR, Intel recommends the use of multiple bulk capacitors rather than a single large
capacitor.
6. Intel strongly recommends that system designers pay close attention to capacitor design recommendations.
Specifically, the "Capacitance vs. Temperature De-rating Curve," "Capacitance vs. Applied DC Voltage De-
rating Curve," and the "Capacitance vs. Frequency De-rating Curve." Some capacitor dielectrics are
particularly susceptible to these conditions, for example Y5V ceramic capacitors.
7. Specifications labeled N/A are not available.
Figure 8
shows the dependence of V_DC ripple current on V_DC.
Power
Plane
Bulk Capacitance Requirements
High Frequency
Capacitance
Requirements
Notes
Total
Capacitance
ESR
Max
RMS Ripple
Current
V_DC
100.0
μ
F
20.0 m
3.0A~ 5.0A
0.1
μ
F, 0.01
μ
F
Notes 1,3,4,5,6
V_5
100.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_3
470.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_3S
100.0
μ
F
100.0 m
N/A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
VCC_AGP
22.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_CPUPU
2.2
μ
F
N/A
N/A
8200.0 pF
Notes 1,5,6,7
V_CLK
10.0
μ
F
N/A
N/A
8200.0 pF
Notes 1,2,5,6,7
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