參數(shù)資料
型號: MCV18ET-I/SO
元件分類: 微控制器/微處理器
英文描述: FLASH, 20 MHz, RISC MICROCONTROLLER, PDSO18
封裝: 7.50 MM, LEAD FREE, SOIC-18
文件頁數(shù): 105/108頁
文件大?。?/td> 1509K
代理商: MCV18ET-I/SO
MCV18E
DS41399A-page 96
2009 Microchip Technology Inc.
11.2
Package Details
The following sections give the technical details of the packages.
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
18
Pitch
e
.100 BSC
Top to Seating Plane
A
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.880
.900
.920
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.014
Upper Lead Width
b1
.045
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
.430
NOTE 1
N
E1
D
1
2
3
A
A1
A2
L
E
eB
c
e
b1
b
Microchip Technology Drawing C04-007B
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