參數(shù)資料
型號(hào)： MNSC140CORE
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
元件分類： 數(shù)字信號(hào)處理
英文描述： Quad Core 16-Bit Digital Signal Processor
中文描述： 四核16位數(shù)字信號(hào)處理器
文件頁數(shù)： 87/88頁
文件大小： 983K
代理商： MNSC140CORE
Thermal Considerations
MSC8122 Technical Data, Rev. 13
Freescale Semiconductor
4-5
4.5 Thermal Considerations
An estimation of the chip-junction temperature
,
T
J
,
in
°
C can be obtained from the following:
T
J
= T
A
+ (R
θ
JA
×
P
D
)
Equation 1
where
T
A
= ambient temperature near the package (
°
C)
R
θ
JA
= junction-to-ambient thermal resistance (
°
C/W)
P
D
= P
INT
+ P
I/O
= power dissipation in the package (W)
P
INT
= I
DD
×
V
DD
= internal power dissipation (W)
P
I/O
= power dissipated from device on output pins (W)
The power dissipation values for the MSC8122 are listed in
Table 2-3
. The ambient temperature for the device is
the air temperature in the immediate vicinity that would cool the device. The junction-to-ambient thermal
resistances are JEDEC standard values that provide a quick and easy estimation of thermal performance. There are
two values in common usage: the value determined on a single layer board and the value obtained on a board with
two planes. The value that more closely approximates a specific application depends on the power dissipated by
other components on the printed circuit board (PCB). The value obtained using a single layer board is appropriate
for tightly packed PCB configurations. The value obtained using a board with internal planes is more appropriate
for boards with low power dissipation (less than 0.02 W/cm
2
with natural convection) and well separated
components. Based on an estimation of junction temperature using this technique, determine whether a more
detailed thermal analysis is required. Standard thermal management techniques can be used to maintain the device
thermal junction temperature below its maximum. If T
J
appears to be too high, either lower the ambient
temperature or the power dissipation of the chip. You can verify the junction temperature by measuring the case
temperature using a small diameter thermocouple (40 gauge is recommended) or an infrared temperature sensor on
a spot on the device case that is painted black. The MSC8122 device case surface is too shiny (low emissivity) to
yield an accurate infrared temperature measurement. Use the following equation to determine T
J
:
T
J
= T
T
+ (
θ
JA
×
P
D
)
Equation 2
where
T
T
= thermocouple (or infrared) temperature on top of the package (
°
C)
θ
JA
= thermal characterization parameter (
°
C/W)
P
D
= power dissipation in the package (W)
Note:
See
MSC8102, MSC8122, and MSC8126 Thermal Management Design Guidelines
(AN2601/D).
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