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參數(shù)資料
| 型號(hào)： | SPC563M64L5COAY |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 80 MHz, MICROCONTROLLER, PQFP144 |
| 封裝： | 20 X 20 MM, LEAD FREE, LQFP-144 |
| 文件頁數(shù)： | 114/140頁 |
| 文件大?。?/td> | 1310K |
| 代理商： | SPC563M64L5COAY |
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Electrical characteristics
SPC563M64
Doc ID 14642 Rev 6
planes also reduce the thermal performance. When the clearance between the vias leave
the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for
the tightly packed printed circuit board. The value obtained on a board with the internal
planes is usually within the normal range if the application board has:
●
One oz. (35 micron nominal thickness) internal planes
●
Components are well separated
●
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the
surrounding components. In addition, the ambient temperature varies widely within the
application. For many natural convection and especially closed box applications, the board
temperature at the perimeter (edge) of the package is approximately the same as the local
air temperature near the device. Specifying the local ambient conditions explicitly as the
board temperature provides a more precise description of the local ambient conditions that
determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following
equation:
Equation 2
TJ = TB + (RθJB * PD)
where:
TB = board temperature for the package perimeter (
oC)
RθJB = junction-to-board thermal resistance (
oC/W) per JESD51-8S
PD = power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an
acceptable value for the junction temperature is predictable. Ensure the application board is
similar to the thermal test condition, with the component soldered to a board with internal
planes.
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance
plus a case-to-ambient thermal resistance:
Equation 3
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (
oC/W)
RθJC = junction-to-case thermal resistance (
oC/W)
RθCA = case to ambient thermal resistance (
oC/W)
RθJC s device related and is not affected by other factors. The thermal environment can be
controlled to change the case-to-ambient thermal resistance, RθCA. For example, change
the air flow around the device, add a heat sink, change the mounting arrangement on the
printed circuit board, or change the thermal dissipation on the printed circuit board
surrounding the device. This description is most useful for packages with heat sinks where
90% of the heat flow is through the case to heat sink to ambient. For most packages, a
better model is required.
A more accurate two-resistor thermal model can be constructed from the junction-to-board
thermal resistance and the junction-to-case thermal resistance. The junction-to-case
thermal resistance describes when using a heat sink or where a substantial amount of heat
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相關(guān)代理商/技術(shù)參數(shù) |
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| SPC563M64L7COAR | 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 80 MHz, 1.5 Mbyte RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| SPC563M64L7COAY | 制造商:STMicroelectronics 功能描述:JDP MICRO - Bulk |
| SPC563M64L7-ENG | 制造商:STMicroelectronics 功能描述:ENG SAMPLES - Bulk |
| SPC563MADPT144S | 功能描述:32位微控制器 - MCU Socketed Mini Mod SPC563M QFP144 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| SPC563MADPT176S | 功能描述:32位微控制器 - MCU Socketed Mini Mod SPC563M QFP176 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
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