參數(shù)資料
型號(hào)： SPC563M64L5COAY
廠商： STMICROELECTRONICS
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 80 MHz, MICROCONTROLLER, PQFP144
封裝： 20 X 20 MM, LEAD FREE, LQFP-144
文件頁數(shù)： 115/140頁
文件大?。?/td> 1310K
代理商： SPC563M64L5COAY
SPC563M64
Electrical characteristics
Doc ID 14642 Rev 6
is dissipated from the top of the package. The junction-to-board thermal resistance
describes the thermal performance when most of the heat is conducted to the printed circuit
board. This model can be used to generate simple estimations and for computational fluid
dynamics (CFD) thermal models.
To determine the junction temperature of the device in the application on a prototype board,
use the thermal characterization parameter (
ΨJT) to determine the junction temperature by
measuring the temperature at the top center of the package case using the following
equation:
Equation 4
TJ = TT + (ΨJT x PD)
where:
TT
= thermocouple temperature on top of the package (oC)
ΨJT
= thermal characterization parameter (oC/W)
PD
= power dissipation in the package (W)
The thermal characterization parameter is measured in compliance with the JESD51-2
specification using a 40-gauge type T thermocouple epoxied to the top center of the
package case. Position the thermocouple so that the thermocouple junction rests on the
package. Place a small amount of epoxy on the thermocouple junction and approximately 1
mm of wire extending from the junction. Place the thermocouple wire flat against the
package case to avoid measurement errors caused by the cooling effects of the
thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
USA
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering
Documents at 800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
●
C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998,
pp. 47-54.
●
G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled
Applications”, Electronic Packaging and Production, pp. 53-58, March 1998.
●
B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal
Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San
Diego, 1999, pp. 212-220.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SPC563M64L7COAR 功能描述:32位微控制器 - MCU 32-BIT Embedded MCU 80 MHz, 1.5 Mbyte RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
SPC563M64L7COAY 制造商:STMicroelectronics 功能描述:JDP MICRO - Bulk
SPC563M64L7-ENG 制造商:STMicroelectronics 功能描述:ENG SAMPLES - Bulk
SPC563MADPT144S 功能描述:32位微控制器 - MCU Socketed Mini Mod SPC563M QFP144 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
SPC563MADPT176S 功能描述:32位微控制器 - MCU Socketed Mini Mod SPC563M QFP176 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
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