參數(shù)資料
型號(hào): 80546KF
廠商: Intel Corp.
英文描述: 64-bit Intel Xeon Processor MP with up to 8MB L3 Cache
中文描述: 64位Intel Xeon處理器MP的高達(dá)8MB三級(jí)高速緩存
文件頁(yè)數(shù): 66/138頁(yè)
文件大小: 2666K
代理商: 80546KF
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66
64-bit Intel
Xeon Processor MP with up to 8MB L3 Cache Datasheet
Mechanical Specifications
4.4
Package Handling Guidelines
Table 4-2
includes a list of guidelines on package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal
.
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5. Handling guidelines are for the package only and do not include the limits of the processor socket.
4.5
Package Insertion Specifications
The processor can be inserted into and removed from a mPGA604 socket 15 times. The socket
should meet the mPGA604 requirements detailed in the
mPGA604 Socket Design Guidelines
.
4.6
Processor Mass Specifications
The typical mass of the processor is 34 g [1.20 oz]. This mass [weight] includes all the components
that are included in the package.
4.7
Processor Materials
Table 4-3
lists some of the package components and associated materials.
Table 4-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
356 N [80 lbf]
1, 4, 5
Tensile
156 N [35 lbf]
2, 4, 5
Torque
8 N-m [70 lbf-in]
3, 4, 5
Table 4-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber-Reinforced Resin
Substrate Pins
Gold Plated Copper
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