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參數(shù)資料
| 型號： | 80546KF |
| 廠商： | Intel Corp. |
| 英文描述： | 64-bit Intel Xeon Processor MP with up to 8MB L3 Cache |
| 中文描述： | 64位Intel Xeon處理器MP的高達8MB三級高速緩存 |
| 文件頁數(shù)： | 98/138頁 |
| 文件大?。?/td> | 2666K |
| 代理商： | 80546KF |
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98
64-bit Intel
Xeon Processor MP with up to 8MB L3 Cache Datasheet
Thermal Specifications
power at which T
CASE
, calculated from the thermal profile, corresponds to the lowest possible
value of Tcontrol. This point is associated with the Tcontrol value (see
Section 7.2.7
). However,
because Tcontrol represents a diode temperature, it is necessary to define the associated case
temperature. This is T
CASE_MAX
@ P
CONTROL_BASE
. Please see
Section 7.2.7
and the Processor
Thermal/Mechanical Design Guidelines for proper usage of the Tcontrol specification.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained time periods. Intel recommends that complete thermal solution designs
target the TDP indicated in
Table 7-1
, instead of the maximum processor power consumption. The
Thermal Monitor feature is intended to help protect the processor in the event that an application
exceeds the TDP recommendation for a sustained time period. For more details on this feature,
refer to
Section 7.2
. To ensure maximum flexibility for future requirements, systems should be
designed to the Flexible Motherboard (FMB) guidelines, even if a processor with a lower thermal
dissipation is currently planned.
Thermal Monitor or Thermal Monitor 2 feature must be
enabled for the processor to remain within specification.
NOTE:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
.
2. FMB, or Flexible Motherboard, guidelines provide a design target for meeting future thermal requirements.
See
Section 2.10.1
for further information on FMB.
3. Maximum Power is the maximum thermal power that can be dissipated by the processor through the
integrated heat spreader. Maximum Power is measured at maximum T
CASE
.
Table 7-1. Processor Thermal Specifications
Core Frequency
Maximum
Power
3
(W)
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch - FMB1
136
129
5
See
Figure 7-1
and
Table 7-2
1,2
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