參數(shù)資料
型號(hào)： AD9852/PCBZ
廠商： Analog Devices Inc
文件頁數(shù)： 35/52頁
文件大小： 0K
描述： BOARD EVAL FOR AD9852
設(shè)計(jì)資源： AD9852 Eval Brd BOM
AD9852 Schematic
標(biāo)準(zhǔn)包裝： 1
系列： AgileRF™
類型： 合成器
適用于相關(guān)產(chǎn)品： AD9852
相關(guān)產(chǎn)品： AD9852ASVZ-ND - IC DDS SYNTHESIZER CMOS 80-TQFP
AD9852ASTZ-ND - IC DDS SYNTHESIZER CMOS 80-LQFP
AD9852
Rev. E | Page 40 of 52
EVALUATION OF OPERATING CONDITIONS
The first step in applying the AD9852 is to select the internal
clock frequency. Clock frequency selections greater than 200 MHz
require use of the thermally enhanced package (AD9852ASVZ);
clock frequency selections equal to or less than 200 MHz may
allow use of the standard (nonthermally enhanced) plastic
surface-mount package, but more information is needed to
make this determination.
The second step is to determine the maximum required
operating temperature for the AD9852 in a given application.
Subtract this value from 150°C, which is the maximum junction
temperature allowed for the AD9852. For the extended indust-
rial temperature range, the maximum operating temperature is
85°C, which results in a difference of 65°C. This is the maxi-
mum temperature gradient the device can experience due to
power dissipation.
The third step is to divide this maximum temperature gradient
by the thermal impedance to determine the maximum power
dissipation allowed for the application. For this example, 65°C
divided by the thermal impedance of the package yields a total
power dissipation limit of 4.1 W and 1.7 W for the thermally and
nonthermally enhanced packages, respectively. Therefore, for a
3.3 V nominal power supply voltage, the current consumed by the
device under full operating conditions must not exceed 515 mA
for the standard plastic package or 1242 mA for the thermally
enhanced package. The total set of enabled functions and
operating conditions for a given application must support these
current consumption limits.
Figure 59 and Figure 60 can be used to determine the suitability
of a given AD9852 application in terms of the power dissipation
requirements. These graphs assume that the AD9852 device is
soldered to a multilayer PCB according to the recommended best
manufacturing practices and procedures for a given package type.
This ensures that the specified thermal impedance specifications
are achieved.
THERMALLY ENHANCED PACKAGE
MOUNTING GUIDELINES
Refer to the AN-772 Application Note for details on mounting
devices with an exposed paddle.
相關(guān)PDF資料
PDF描述
X24-009-DK KIT DEV 2.4GHZ 9600BPS W/RPSMA
0622022510 TOOL INSERTION 30POS 3ROWS
TC70V3I32K7680 OSCILLATOR 32.7680 KHZ 1.5V SMD
TC70M3I32K7680 OSCILLATOR 32.7680 KHZ 1.8V SMD
TC70N3I32K7680 OSCILLATOR 32.7680 KHZ 2.5V SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD9853 制造商:AD 制造商全稱:Analog Devices 功能描述:Programmable Digital OPSK/16-QAM Modulator
AD9853-45PCB 制造商:AD 制造商全稱:Analog Devices 功能描述:Programmable Digital OPSK/16-QAM Modulator
AD9853-65PCB 制造商:AD 制造商全稱:Analog Devices 功能描述:Programmable Digital OPSK/16-QAM Modulator
AD9853AS 制造商:Analog Devices 功能描述: 制造商:Rochester Electronics LLC 功能描述:- Bulk
AD9854 制造商:AD 制造商全稱:Analog Devices 功能描述:CMOS 300 MHz Quadrature Complete-DDS
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*