參數(shù)資料
型號(hào): ADSP-21469KBCZ-3
廠商: Analog Devices Inc
文件頁數(shù): 66/72頁
文件大小: 0K
描述: IC DSP 32/40BIT 400MHZ 324BGA
產(chǎn)品變化通告: Pin Function Change 08/Mar/2012
標(biāo)準(zhǔn)包裝: 1
系列: SHARC®
類型: 浮點(diǎn)
接口: DAI,DPI,EBI/EMI,I²C,SCI,SPI,SSP,UART/USART
時(shí)鐘速率: 400MHz
非易失內(nèi)存: 外部
芯片上RAM: 5Mb
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.05V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 324-BGA,CSPBGA
供應(yīng)商設(shè)備封裝: 324-CSPBGA
包裝: 托盤
ADSP-21469
Rev. 0
|
Page 69 of 72
|
June 2010
OUTLINE DIMENSIONS
The ADSP-21469 processor is available in a 19 mm by 19 mm
CSP_BGA lead-free package.
SURFACE-MOUNT DESIGN
The following table is provided as an aid to PCB design. For
industry-standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface-Mount Design and Land Pat-
tern Standard.
Figure 60. 324-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
(BC-324-1)
Dimensions shown in millimeters
*COMPLIANT TO JEDEC STANDARDS MO-192-AAG-1 WITH
THE EXCEPTION TO PACKAGE HEIGHT.
1.00
BSC
1.00
REF
A
B
C
D
E
F
G
9
8
11
10
13
12
7
6
5
42
31
BOTTOM VIEW
17.00
BSC SQ
H
J
K
L
M
N
P
R
T
U
V
0.50 NOM
0.45 MIN
DETAIL A
TOP VIEW
DETAIL A
COPLANARITY
0.20
0.70
0.60
0.50
BALL DIAMETER
SEATING
PLANE
19.10
19.00 SQ
18.90
A1 BALL
CORNER
A1 BALL
CORNER
*1.80
1.71
1.56
1.31
1.21
1.11
15
14
17
16
18
Package
Package Ball Attach Type
Package Solder Mask
Opening
Package Ball Pad Size
324-Ball CSP_BGA (BC-324-1)
Solder Mask Defined
0.43 mm diameter
0.6 mm diameter
相關(guān)PDF資料
PDF描述
DS1620S+ IC THERMOMETER/STAT DIG 8-SOIC
XC2C384-10FGG324I IC CR-II CPLD 384MCELL 324-FBGA
MAX31855JASA+ IC CONV THERMOCOUPLE-DGTL 8SOIC
VE-B1N-CW-B1 CONVERTER MOD DC/DC 18.5V 100W
ADSP-21489BSWZ-4B IC CCD SIGNAL PROCESSOR 176LQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-21469KBCZ-4 功能描述:IC DSP 32/40BIT 450MHZ 324BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C,McASP,McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
ADSP21469KBCZENG 制造商:Analog Devices 功能描述:
ADSP-21469KBCZ-ENG 制造商:Analog Devices 功能描述:FXD PT PROC - Trays
ADSP-21469KBCZ-X 制造商:Analog Devices 功能描述:FXD PT PROC - Trays
ADSP-21469KBZ-EN 制造商:Analog Devices 功能描述: