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TMS320TCI6482
Communications Infrastructure Digital Signal Processor
SPRS246F–APRIL 2005–REVISED MAY 2007
Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
TYPE
(1)
IPD/IPU
(2)
DESCRIPTION
NO.
SUPPLY VOLTAGE MONITOR PINS
Die-side 1.2-V core supply (CV
) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. For more information regarding the use of this
and other voltage monitoring pins, see the
TMS320TCI6482 Design Guide and
Comparisons to TMS320TCI100
application report (literature number
SPRAAC7
). If the CV
pin is not used, it should be connected directly to
the 1.2-V core supply (CV
DD
).
Die-side 3.3-V I/O supply (DV
) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. For more information regarding the use of this
and other voltage monitoring pins, see the
TMS320TCI6482 Design Guide and
Comparisons to TMS320TCI100
application report (literature number
SPRAAC7
). If the DV
pin is not used, it should be connected directly to
the 3.3-V I/O supply (DV
DD33
).
Die-side 1.5-/1.8-V I/O supply (DV
) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. For more information regarding the use of this
and other voltage monitoring pins, see the
TMS320TCI6482 Design Guide and
Comparisons to TMS320TCI100
application report (literature number
SPRAAC7
). If the DV
pin is not used, it should be connected directly to
the 1.5-/1.8-V I/O supply (DV
).
NOTE:
If the RGMII mode of the EMAC is not used, the DV
, DV
,
V
, RSV13, and RSV14 pins can be connected directly to ground (V
)
to save power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see
Section 8.3.4
.
Die-side 1.8-V I/O supply (DV
) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. For more information regarding the use of this
and other voltage monitoring pins, see the
TMS320TCI6482 Design Guide and
Comparisons to TMS320TCI100
application report (literature number
SPRAAC7
). If the DV
pin is not used, it should be connected directly to
the 1.8-V I/O supply (DV
DD18
).
SUPPLY VOLTAGE PINS
(DV
/2)-V reference for SSTL buffer (DDR2 Memory Controller). This input
voltage can be generated directly from DV
DD18
using two 1-k
resistors to form
a resistor divider circuit.
NOTE:
The DDR2 Memory Controller is not used, the V
, RSV11, and
RSV12 pins can be connected directly to ground (V
) to save power.
However, connecting these pins directly to ground will prevent boundary-scan
from functioning on the DDR2 Memory Controller pins. To preserve
boundary-scan functionality on the DDR2 Memory Controller pins, see
Section 8.3.4
.
(DV
/2)-V reference for HSTL buffer (EMAC RGMII). V
can be
generated directly from DV
DD15
using two 1-k
resistors to form a resistor
divider circuit.
NOTE:
If the RGMII mode of the EMAC is not used, the DV
, V
,
RSV13, and RSV14 pins can be connected to directly ground (V
) to save
power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see
Section 8.3.4
.
1.8-V I/O supply voltage (SRIO regulator supply).
NOTE:
If Rapid I/O is not used, this pin can be connected directly to V
SS
.
SRIO analog supply:
1.25-V I/O supply voltage (-1000 devices)
1.2-V I/O supply voltage (-850 devices).
Do not
use core supply.
NOTE:
If Rapid I/O is not used, these pins can be connected directly to V
SS
.
CV
DDMON
N1
DV
DD33MON
L6
DV
DD15MON
F3
I
DV
DD18MON
A26
V
REFSSTL
C14
A
V
REFHSTL
B2
A
DV
DDR
AD20
S
AC15
AC17
AV
DDA
A
AD16
AV
DLL1
AV
DLL2
A13
E18
A
1.8-V I/O supply voltage.
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