www.ti.com
C64x+ DSP:
TCI6482
PREFIX
TMX = Experimental device
TMS = Qualified device
TMS
320
TCI6482
ZTZ
DEVICE FAMILY
320 = TMS320 DSP family
PACKAGE TYPE
ZTZ = 697-pin plastic BGA, with Pb-Free solder balls
GTZ = 697-pin plastic BGA, with Pb-ed solder balls
(B)
DEVICE
A. The extended temperature “A version” devices may have different operating conditions than the commercial temperature devices.
For more details, see the
Recommended Operating Conditions
section of this document.
B.
BGA = Ball Grid Array
DEVICE SPEED RANGE
8 = 850 MHz
Blank = 1 GHz
( )
( )
TEMPERATURE RANGE
Blank = 0°C to +90°C (default commercial temperature)
A = -40°C to 105°C (extended temperature)
(A)
TMS320TCI6482
Communications Infrastructure Digital Signal Processor
SPRS246F–APRIL 2005–REVISED MAY 2007
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ZTZ), the temperature range (for example, blank is the default commercial
temperature range), and the device speed range, in megahertz (for example, blank is 1000 MHz [1 GHz]).
Figure 2-13
provides a legend for reading the complete device name for any TMS320C64x+ DSP
generation member.
For device part numbers and further ordering information for TMS320TCI6482 in the ZTZ/GTZ package
type, see the TI website (
www.ti.com
) or contact your TI sales representative.
Figure 2-13. TMS320C64x+ DSP Device Nomenclature (including the TMS320TCI6482 DSP)
2.8.2.2
Documentation Support
The following documents describe the TMS320TCI6482 Communications Infrastructure Digital Signal
Processor. Copies of these documents are available on the Internet at
www.ti.com
.
Tip:
Enter the
literature number in the search box provided at www.ti.com.
The current documentation that describes the TMS320TCI6482, related peripherals, and other technical
collateral, is available in the C6000 DSP product folder at:
www.ti.com/c6000
.
SPRU732
TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide.
Describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+
digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP
generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an
enhancement of the C64x DSP with added functionality and an expanded instruction set.
SPRU871
TMS320C64x+ Megamodule Reference Guide.
Describes the TMS320C64x+ digital signal
processor (DSP) megamodule. Included is a discussion on the internal direct memory
access (IDMA) controller, the interrupt controller, the power-down controller, memory
protection, bandwidth management, and the memory and cache.
SPRU965
TMS320C6455 Technical Reference.
Covers the features of the C6455 DSP and describes
how, while utilizing the C64x+ core, it extends the performance by offering greater
multiplication bandwidth, higher I/O bandwidth,and larger and more flexible on-chip memory
while addressing code size and system issues.
SPRAA84
TMS320C64x to TMS320C64x+ CPU Migration Guide.
Describes migrating from the Texas
Instruments TMS320C64x digital signal processor (DSP) to the TMS320C64x+ DSP. The
objective of this document is to indicate differences between the two cores. Functionality in
the devices that is identical is not included.
SPRU889
High-Speed DSP Systems Design Reference Guide.
Provides recommendations for
meeting the many challenges of high-speed DSP system design. These recommendations
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Device Overview
51