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Packaging
11 – Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also
evolved to provide improved performance and flexibility.
Actel consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Actel IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also
flexible enough to accommodate stringent form factor requirements for Chip Scale Packaging
(CSP). In addition, Actel offers a variety of packages designed to meet your most demanding
application and economic requirements for today's embedded and mobile systems.
The following documents provide packaging information and device selection for low-power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member
of the family. Use this document or the datasheet tables to determine the best package for your
design, and which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Actel. Use the bookmarks to navigate to the package mechanical drawings.
Related Documents
Additional packaging materials are available at
Part Number and Revision Date
This document contains content extracted from the Device Architecture section of the datasheet,
combined with content previously published as an application note describing features and
functions of the device. To improve usability for customers, the device architecture information has
now been combined with usage information, to reduce duplication and possible inconsistencies in
published information. No technical changes were made to the datasheet content unless explicitly
listed. Changes to the application note content were made only to be consistent with existing
datasheet information.
Part Number 5170009-012-0
Revised January 2008