參數(shù)資料
型號： AD5522JSVDZ
廠商： Analog Devices Inc
文件頁數(shù)： 7/64頁
文件大小： 0K
描述： IC PMU QUAD 16BIT DAC 80-TQFP
產(chǎn)品變化通告： Improve FI ac crosstalk
設(shè)計資源： Parametric Measurement Unit and Supporting Components for PAD Appls Using AD5522 and AD7685 (CN0104)
標(biāo)準包裝： 1
類型： 每引腳參數(shù)測量單元（PPMU）
應(yīng)用： 自動測試設(shè)備
安裝類型： 表面貼裝
封裝/外殼： 80-TQFP 裸露焊盤
供應(yīng)商設(shè)備封裝： 80-TQFP（12x12）
包裝： 托盤
產(chǎn)品目錄頁面： 798 (CN2011-ZH PDF)
Data Sheet
AD5522
Rev. E | Page 15 of 64
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage, AVDD to AVSS
34 V
AVDD to AGND
0.3 V to +34 V
AVSS to AGND
+0.3 V to 34 V
VREF to AGND
0.3 V to +7 V
DUTGND to AGND
AVDD + 0.3 V to AVSS 0.3 V
REFGND to AGND
AVDD + 0.3 V to AVSS 0.3 V
DVCC to DGND
0.3 V to +7 V
AGND to DGND
0.3 V to +0.3 V
Digital Inputs to DGND
0.3 V to DVCC + 0.3 V
Analog Inputs to AGND
AVSS 0.3 V to AVDD + 0.3 V
Storage Temperature Range
65°C to +125°C
Operating Junction Temperature
Range (J Version)
25°C to 90°C
Reflow Soldering
JEDEC Standard (J-STD-020)
Junction Temperature
150°C max
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal resistance values are specified for the worst-case
conditions, that is, a device soldered in a circuit board for
surface-mount packages.
Table 5. Thermal Resistance1 (JEDEC 4-Layer (1S2P) Board)
Package Type
Airflow
(LFPM)
θJA
θJC
Unit
TQFP Exposed Pad on Bottom
4.8
°C/W
No Heat Sink2
0
22.3
°C/W
200
17.2
°C/W
500
15.1
°C/W
With Cooling Plate at 45°C3
5.4
4.8
°C/W
TQFP Exposed Pad on Top
2
°C/W
No Heat Sink2
0
42.4
°C/W
200
37.2
°C/W
500
35.7
°C/W
With Cooling Plate at 45°C3
3.0
2
°C/W
1
The information in this section is based on simulated thermal information.
2
These values apply to the package with no heat sink attached. The actual
thermal performance of the package depends on the attached heat sink and
environmental conditions.
3
Natural convection at 55°C ambient. Assumes perfect thermal contact
between the cooling plate and the exposed paddle.
4
N/A means not applicable.
ESD CAUTION
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