Advance Information Datasheet
3
Contents
Contents
1.0
Introduction
....................................................................................................................................7
1.1
Overview...............................................................................................................................9
1.2
About this Document ..........................................................................................................10
2.0
Package Information
...................................................................................................................11
2.1
Ball Location .......................................................................................................................11
2.2
Mechanical Specifications ..................................................................................................23
3.0
Signal Descriptions
.....................................................................................................................25
3.1
Alphabetical Signal Reference............................................................................................25
3.2
Signals Grouped By Type...................................................................................................36
3.2.1
Hub Interface to Host Controller ............................................................................36
3.2.2
Link to LAN Connect..............................................................................................36
3.2.3
EEPROM Interface ................................................................................................36
3.2.4
Firmware Hub Interface .........................................................................................37
3.2.5
PCI Interface..........................................................................................................37
3.2.6
IDE Interface..........................................................................................................40
3.2.7
LPC Interface.........................................................................................................41
3.2.8
Interrupt Interface ..................................................................................................41
3.2.9
USB Interface ........................................................................................................42
3.2.10 Power Signals........................................................................................................42
3.2.11 Processor Interface................................................................................................43
3.2.12 SMBus Interface ....................................................................................................44
3.2.13 System Management Interface..............................................................................44
3.2.14 Real Time Clock Interface .....................................................................................44
3.2.15 Other Clocks..........................................................................................................45
3.2.16 Universal Asynchronous Receive and Transmit (UART 0,1).................................45
3.2.17 SIU LPC Interface..................................................................................................46
3.2.18 Miscellaneous Signals ...........................................................................................47
3.2.19 General Purpose I/O..............................................................................................47
3.2.20 Power and Ground.................................................................................................48
3.3
Pin Straps ...........................................................................................................................49
3.3.1
Functional Straps...................................................................................................49
3.3.2
Test Signals...........................................................................................................49
3.3.2.1
Test Mode Selection ..............................................................................49
3.3.2.2
Test Straps.............................................................................................50
3.3.3
External RTC Circuitry...........................................................................................50
3.3.4
V5REF/Vcc3_3 Sequencing Requirements...........................................................51
3.4
Power Planes and Pin States .............................................................................................51
3.4.1
Power Planes.........................................................................................................51
3.4.2
Integrated Pull-Ups and Pull-Downs......................................................................52
3.4.3
IDE Integrated Series Termination Resistors.........................................................52
3.4.4
Output and I/O Signals Planes and States ............................................................53
3.4.5
Power Planes for Input Signals..............................................................................55
4.0
Electrical Characteristics
............................................................................................................57
4.1
Absolute Maximum Ratings................................................................................................57