參數(shù)資料
型號： pentium III
廠商： Intel Corp.
英文描述： pentium III Processor for the PGA370 Socket at 500MHz to 933MHz(工作頻率500到933兆赫茲活動帶PGA370插孔奔III處理器)
中文描述： 奔騰III處理器在500MHz到933MHz的（工作頻率500到933兆赫茲活動帶PGA370插孔奔三處理器的PGA370插座）
文件頁數(shù)： 4/78頁
文件大小： 610K
代理商： PENTIUM III
Pentium
III Processor for the PGA370 Socket at 500 MHz to 933 MHz
4
Datasheet
3.4
Non-AGTL+ Signal Quality Specifications and Measurement Guidelines...........43
3.4.1
Overshoot/Undershoot Guidelines.........................................................44
3.4.2
Ringback Specification...........................................................................44
3.4.3
Settling Limit Guideline ..........................................................................44
4.0
Thermal Specifications and Design Considerations.........................................................45
4.1
Thermal Specifications........................................................................................45
4.1.1
Thermal Diode........................................................................................46
5.0
Mechanical Specifications...............................................................................................48
5.1
FC-PGA Mechanical Specifications ....................................................................48
5.2
Processor Markings ............................................................................................50
5.3
Processor Signal Listing......................................................................................50
6.0
Boxed Processor Specifications.......................................................................................62
6.1
Mechanical Specifications...................................................................................62
6.1.1
Boxed Processor Thermal Cooling Solution Dimensions.......................62
6.1.2
Boxed Processor Heatsink Weight.........................................................64
6.1.3
Boxed Processor Thermal Cooling Solution Clip ...................................64
6.2
Boxed Processor Requirements .........................................................................65
6.2.1
Fan Heatsink Power Supply...................................................................65
6.3
Thermal Specifications........................................................................................66
6.3.1
Boxed Processor Cooling Requirements ...............................................66
7.0
Processor Signal Description...........................................................................................68
7.1
Alphabetical Signals Reference ..........................................................................68
7.2
Signal Summaries...............................................................................................75
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