- 您現在的位置：買賣IC網 > PDF目錄367908 > pentium III (Intel Corp.) pentium III Processor for the PGA370 Socket at 500MHz to 933MHz(工作頻率500到933兆赫茲活動帶PGA370插孔奔III處理器) PDF資料下載
參數資料
| 型號： | pentium III |
| 廠商： | Intel Corp. |
| 英文描述： | pentium III Processor for the PGA370 Socket at 500MHz to 933MHz(工作頻率500到933兆赫茲活動帶PGA370插孔奔III處理器) |
| 中文描述： | 奔騰III處理器在500MHz到933MHz的（工作頻率500到933兆赫茲活動帶PGA370插孔奔三處理器的PGA370插座） |
| 文件頁數： | 45/78頁 |
| 文件大?。?/td> | 610K |
| 代理商： | PENTIUM III |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁當前第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁
Datasheet
45
Pentium
III Processor for the PGA370 Socket at 500 MHz to 933 MHz
4.0
Thermal Specifications and Design Considerations
This chapter provides needed data for designing a thermal solution. However, for the correct
thermal measuring processes, refer to AP-905,
Intel
Pentium
III
Processor Thermal Design
Guidelines
(Order Number 245087). The Pentium
III
processor uses flip chip pin grid array
packaging technology and has a
junction
temperature (T
junction
) specified.
4.1
Thermal Specifications
Table 24
provides the thermal design power dissipation and maximum temperatures for the
Pentium
III
processor for the PGA370 socket. Systems should design for the highest possible
processor power, even if a processor with a lower thermal dissipation is planned. A thermal
solution should be designed to ensure the junction temperature never exceeds these specifications.
NOTES:
1. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to
dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum Tjunction specification.
2. TDP does not represent the power delivery and voltage regulation requirements for the processor. Refer to
Table 6 for voltage regulation and electrical specifications.
3. T
is the worst-case difference between the thermal reading from the on-die thermal diode and the
hottest location on the processor’s core.
4. T
values do not include any thermal diode kit measurement error. Diode kit measurement error
must be added to the T
value from the table, as outlined in the Pentium
III Processor Thermal
Design Guidelines. Intel has characterized the use of the Analog Devices AD1021 diode measurement kit
and found its measurement error to be 1 °C.
Table 24. Intel
Pentium
III Processor for the PGA370 Socket Thermal Specifications
Processor
Processor
Core
Frequency
(MHz)
L2 Cache
Size
(Kbytes)
Processor
Thermal
Design
Power
1,2
(W)
Power
Density
5
(W/cm
2
)
Maximum
T
JUNCTION
T
JUNC3,4,6
Offset
(°C)
500E
500
256
13.2
18.2
85
1.9
533EB
533
256
14.0
19.3
85
2.0
550E
550
256
14.5
20.0
85
2.1
600E
600
256
15.8
21.8
82
2.3
600EB
600
256
15.8
21.8
82
2.3
650
650
256
17.0
23.4
82
2.5
667
667
256
17.5
24.1
82
2.5
700
700
256
18.3
25.2
80
2.7
733
733
256
19.1
26.3
80
2.8
750
750
256
19.5
26.9
80
2.8
800
800
256
20.8
28.7
80
3.0
800EB
800
256
20.8
28.7
80
3.0
850
850
256
22.5
31.0
80
3.3
866
866
256
22.9
31.5
80
3.3
933
933
256
24.5
33.8
75
3.6
相關PDF資料 |
PDF描述 |
|---|---|
| pentium II | pentium II processor With On-die Cache Mobile Module Connector 1 (MMC-1)(帶緩存和連接器1的奔II處理器) |
| PERICOMPI7C8150 | 2-Port PCI-to-PCI Bridge |
| PESDXL2BT | Low capacitance double bidirectional ESD protection diodes in SOT23 |
| PESDXL2UM | LJT 23C 21#20 2#16 PIN RECP |
| PETAM1270BK300R | BRAID SLEEVING 300M |
相關代理商/技術參數 |
參數描述 |
|---|---|
| P-ENV568K3G3 | 制造商:Panasonic Industrial Company 功能描述:TUNER |
| PEO14012 | 制造商:TE Connectivity 功能描述:RELAY SPCO 12VDC |
| PEO14024 | 制造商:TE Connectivity 功能描述:RELAY SPCO 24VDC |
| PEO96742 | 制造商:Delphi Corporation 功能描述:ASM TERM |
| PEOODO3A | 制造商:MACOM 制造商全稱:Tyco Electronics 功能描述:Versatile Power Entry Module with Small Footprint |
發(fā)布緊急采購，3分鐘左右您將得到回復。