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| 型號： | IDT88K8483BRI |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 113/162頁 |
| 文件大小： | 0K |
| 描述： | IC SPI-4 EXCHANGE 3PORT 672-BGA |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | * |
| 其它名稱： | 88K8483BRI |
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October 20, 2006
IDT IDT88K8483
PFP Ingress Flow Control for over booking mode
There are 4 main parameters for configuring the PFP ingress flow control for over booking mode:
- Maximum number of segments per LID is configured in M field in the PFP Buffer Segment Assign Table (p. 120).
- Starving Free segments per LID is configured in THR_STARV field in the PFP Buffer Segment Assign Table (p. 120).
- Hungry Free segments per LID is configured in THR_HUNG field in the PFP Buffer Segment Assign Table (p. 120).
- Global Free segments per LID is configured in the BUF_THR field in the PFP Buffer Management Configuration Register (p. 123).
There are three status options per LID in the SPI-4 ingress PFP: starving hungry and satisfied. In SPI-4 ingress PFP for LP0/LP1 (for example), in
normal operation there are enough free segments, so the LIDs status are starving, and the SPI-4 ingress interface is sending starving status to the
adjacent device through the status bus. When the number of free segments for each LID is less than THR_STARV (for example 400 segments), the
LID status is changed to hungry, and the SPI-4 ingress interface starts sending hungry status to the adjacent device. When the number of free
segments for each LID is less than THR_HUNG (for example 300 segments), the LID status is changed to satisfied, and the SPI-4 ingress interface
starts sending satisfied status to the adjacent device. When the total number of free segments for all the LIDs is less than BUF_THR (for example 50
segments), the status of all the LIDs are changed to satisfied, and the SPI-4 ingress interface starts sending satisfied status to the adjacent device.
Figure 22 PFP Flow Control Example For Over Booking Mode
Detailed examples:
Example 1. LID0 gets data for 120 segments and LID2 gets data for 120 segments, so LID0 has 392 free segments and LID0 has 392 free
segments. In this case, the number of free segments for LID0 is less than THR_STARV (400), so LID0 sends hungry status to the adjacent device.
The number of free segments for LID1 is also less than THR_STARV (400), so LID1 sends hungry indication to the adjacent device.
Example 2. LID0 gets data for 220 segments and LID1 gets data for 220 segments, so LID0 has 292 free segments and LID1 also has 292 free
segments. In this case, the number of free segments for LID0 is less than THR_HUNG (300), so LID0 sends satisfied status to the adjacent device.
The number of free segments for LID1 is also less than THR_HUNG (300), so LID1 sends satisfied indication to the adjacent device.
Example 3. LID0 gets data for 250 segments and LID2 gets data for 250 segments, so the total number of occupied segments for both LID0 and
LID1 is 500, and the total number of free segments for both LID0 and LID1 is 12. In this case, the total number of free segments for both LID0 and
LID1 is less than BUF_THR (50), so LID0 and LID1 send satisfied status to the adjacent device.
Satisfied
Starving
PFP (508 segments, 127K bytes)
Hungry
Starving Free Segments for LIDs 0 and 1 = 400
Hungry Free Segments for LIDs 0 and 1 = 300
Maximum Number Of Segments for LIDs 0 and 1 = 508
Global Free Segments for LIDs 0 and 1 = 50
Hungry / Satisfied
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| IDT88P8341BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
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| IDT88P8342BHGI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT88P8342BHI | 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT88P8344 | 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0 |
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