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參數(shù)資料
| 型號(hào)： | LMK04000BEVALXO |
| 廠商： | National Semiconductor |
| 文件頁數(shù)： | 42/65頁 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL PREC CLOCK PLL XO |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | PowerWise® |
| 主要目的： | 計(jì)時(shí)，時(shí)鐘調(diào)節(jié)器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | LMK04000 |
| 主要屬性： | 122.88 MHz 晶體 |
| 次要屬性： | 集成式 PLL 和 VCO |
| 已供物品： | 板，線纜 |
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0.33 mm, typ
1.2 mm, typ
5.0 mm, min
SNOSAZ8J – SEPTEMBER 2008 – REVISED SEPTEMBER 2011
Power Supply Conditioning
The recommended technique for power supply management is to connect the power pins for the clock outputs
(pins 13, 37, 40, 43, and 46) to a dedicated power plane and connect all other power pins on the device (pins 3,
8, 18, 19, 22, 24, 30, 31, and 33) to a second power plane. Note: the LMK04000 family has internal voltage
regulators for the PLL and VCO blocks to provide noise immunity.
Thermal Management
Power consumption of the LMK04000 family of devices can be high enough to require attention to thermal
management. For reliability and performance reasons the die temperature should be limited to a maximum of
125 °C. That is, as an estimate, TA (ambient temperature) plus device power consumption times θJA should not
exceed 125 °C.
The package of the device has an exposed pad that provides the primary heat removal path as well as excellent
electrical grounding to a printed circuit board. To maximize the removal of heat from the package a thermal land
pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the
package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. A
recommended land and via pattern is shown in Figure 15. More information on soldering WQFN packages can
be obtained: http://www.national.com/analog/packaging/.
Figure 15. Recommended Land and Via Pattern
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground
plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite
side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but
should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in
Figure 15 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat
pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively
dissipated.
Copyright 2008–2011, Texas Instruments Incorporated
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| LMK04000BISQ | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Low-Noise Clock Jitter Cleaner with Cascaded PLLs |
| LMK04000BISQ/NOPB | 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel |
| LMK04000BISQE | 制造商:Texas Instruments 功能描述:Clock Conditioner 48-Pin LLP EP T/R |
| LMK04000BISQE/NOPB | 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel |
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