參數(shù)資料
型號: MPC7450RX667LX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 667 MHz, RISC PROCESSOR, CBGA483
封裝: 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483
文件頁數(shù): 49/60頁
文件大?。?/td> 1296K
代理商: MPC7450RX667LX
MPC7450 RISC Microprocessor Hardware Specifications
53
System Design Information
(pulled down). While shown on the COP header, not all emulator products drive this signal. To preserve
correct power down operation, QACK should be merged so that it also can be driven by the PCI bridge.
Table 21 shows the pin definitions for the pin numbering shown in Figure 26.
1.9.9 Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see Figure 27); however, due to the potential large mass
of the heat sink, attachment through the printed circuit board is suggested. If a spring clip is used, the spring
force should not exceed 5.5 pounds.
Table 21. COP Pin Definitions
Pins
Signal
Connection
Special Notes
1TDO
TDO
2
QACK
Add 2K pull-down to ground. Must be merged with on-board
QACK, if any.
3TDI
TDI
4TRST
TRST
Add 2K pull-down to ground. Must be merged with on-board
TRST, if any. See Figure 25
5
RUN/STOP
No Connect
Not used
6
VDD_SENSE
VDD
Add 2K pull-up to OVDD (for short circuit limiting protection
only).
7TCK
TCK
8CKSTP_IN
CKSTP_IN
Optional. Add 10K pull-up to OVDD. Used on several emulator
products. Useful for checkstopping the processor from a logic
analyzer or other external trigger.
9TMS
TMS
10
N/A
11
SRESET
Merge with on-board SRESET, if any.
12
N/A
13
HRESET
Merge with on-board HRESET.
14
N/A
Key location; pin should be removed.
15
CKSTP_OUT
Add 10K pull-up to VDD.
16
Ground
Digital Ground
相關(guān)PDF資料
PDF描述
MPC7450RX600LX 32-BIT, 600 MHz, RISC PROCESSOR, CBGA483
MPC8241TZQ200D 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357
MPC8241LVR266D 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357
MPC8241LVR166D 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
MPC8241LZQ166D 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC7455 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications
MPC7457 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications
MPC7457EC 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications
MPC745BPX300LE 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC745BPX350LE 功能描述:微處理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324