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參數(shù)資料
| 型號： | MPC7450RX667LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 667 MHz, RISC PROCESSOR, CBGA483 |
| 封裝： | 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件頁數(shù)： | 7/60頁 |
| 文件大?。?/td> | 1296K |
| 代理商： | MPC7450RX667LX |
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MPC7450 RISC Microprocessor Hardware Specifications
15
Electrical and Thermal Characteristics
The MPC7450 incorporates a thermal management assist unit (TAU) composed of a thermal sensor,
digital-to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See
the MPC7450 RISC Microprocessor User’s Manual for more information on the use of this feature.
Specifications for the thermal sensor portion of the TAU are found in Table 6.
Table 7 provides the DC electrical characteristics for the MPC7450.
Table 5. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
CBGA package thermal resistance, junction-to-case thermal resistance
(typical)
θ
JC
<0.1
°C/W
CBGA package thermal resistance, die junction-to-lead thermal resistance
(typical)
θ
JB
2.2
°C/W
Note: Refer to Section 1.9, “System Design Information,” for more details about thermal management.
Table 6. Thermal Sensor Specifications
At recommended operating condition. See Table 4.
Characteristic
Min
Max
Unit
Notes
Temperature range
0
127
°C
1
Comparator settling time
20
—
s
2
Resolution
4
—
°C
3
Accuracy
–12
+12
°C
3
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an
absolute temperature, but it must be interpreted by software to derive the absolute junction temperature. For
information about the use and calibration of the TAU, see Motorola application note, “Programming the Thermal
Assist Unit in the MPC750 Microprocessor,” (order #: AN1800/D).
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into
the THRM3 SPR.
3. Guaranteed by design and characterization.
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