參數(shù)資料
型號(hào)： MPC7450RX667LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, CBGA483
封裝： 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483
文件頁數(shù)： 50/60頁
文件大?。?/td> 1296K
代理商： MPC7450RX667LX
54
MPC7450 RISC Microprocessor Hardware Specifications
System Design Information
Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7450. There are
several commercially available heat sinks for the MPC7450 provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
Internet: www.chipcoolers.com
International Electronic Research Corporation (IERC)818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Internet: www.ctscorp.com
Thermalloy
972-243-4321
2021 W. Valley View Lane
Dallas, TX 75234-8993
Internet: www.thermalloy.com
Wakefield Engineering
781-406-3000
100 Cummings Center, Suite 157H
Beverly, MA 01915
Internet: www.wakefield.com
Aavid Engineering
972-551-7330
250 Apache Trail
Terrell, TX 75160
Internet: www.aavid.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
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