參數(shù)資料
型號(hào)： MSC8102M4000
廠商： MOTOROLA INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 32-BIT, 75 MHz, OTHER DSP, CBGA431
封裝： 20 X 20 MM, FLIP CHIP, CERAMIC, BGA-431
文件頁(yè)數(shù)： 27/96頁(yè)
文件大?。?/td> 1557K
代理商： MSC8102M4000
2-3
DC Electrical Characteristics
This section describes the DC electrical characteristics for the MSC8102. The measurements in Table 2-4
assume the following system conditions:
TA = 25 °C
VDD = 1.55–1.7 VDC
VDDH = 3.3 V ± 5% VDC
GND = 0 VDC
Note:
The leakage current is measured for nominal VDDH and VDD or both VDDH and VDD must vary in
the same direction (for example, both VDDH and VDD vary by +2 percent or both vary by –2
percent).
2.6.1 Load Assumptions
The following sections include illustrations and tables of clock diagrams, signals, and parallel I/O outputs
and inputs. When designing systems such as DSP farms using the DSI, use a device loading of 4 pF per
pin. AC timings are based on a 50 pF load, except where noted otherwise, and a 50
transmission line.
For any additional pF, add 0.07 ns for the delay and take the RC delay into consideration.
Table 2-4. DC Electrical Characteristics
Characteristic
Symbol
Min
Typical
Max
Unit
Input high voltage, all inputs except CLKIN
VIH
2.0
3.0
3.465
V
Input low voltage
VIL
GND
0
0.4
V
CLKIN input high voltage
VIHC
2.4
3.0
3.465
V
CLKIN input low voltage
VILC
GND
0
0.4
V
Input leakage current, VIN = VDDH
IIN
–1.0
0.09
1
A
Tri-state (high impedance off state) leakage current,
VIN = VDDH
IOZ
–1.0
0.09
1
A
Signal low input current, VIL = 0.4 V
IL
–1.0
0.09
1
A
Signal high input current, VIH = 2.0 V
IH
–1.0
0.09
1
A
Output high voltage, IOH = –2 mA,
except open drain pins
VOH
2.0
3.0
—
V
Output low voltage, IOL= 3.2 mA
VOL
—0
0.4
V
Typical power consumption at:
250 MHz
275 MHz
P
—
1.35
1.47
—
W
Note:
The typical power values were measured using an EFR code with the device running at room temperature
(TA = 25°C). No peripherals were enabled and ICache was not enabled. The source code was optimized to
utilize all the ALUs and AGUs and all four cores. It was created using CodeWarrior 2.5 by Metrowerks.
These values are provided as examples only. Power consumption is application dependent and varies
widely. To assure proper board design with regard to thermal dissipation and maintaining proper operating
temperatures, evaluate power consumption for your application and use the design guidelines in Chapter 4
of this document and in AN2601/D MSC8102 Thermal Management Design Guidelines.
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