參數(shù)資料
型號(hào): MSC8102M4000
廠商: MOTOROLA INC
元件分類: 數(shù)字信號(hào)處理
英文描述: 32-BIT, 75 MHz, OTHER DSP, CBGA431
封裝: 20 X 20 MM, FLIP CHIP, CERAMIC, BGA-431
文件頁數(shù): 87/96頁
文件大?。?/td> 1557K
代理商: MSC8102M4000
3-34
FC-CBGA (HCTE) Package Mechanical Drawing
3.3 FC-CBGA (HCTE) Package Mechanical Drawing
Figure 3-3. MSC8102 Mechanical Information, 431-pin FC-CBGA (HCTE) Package
CASE 1453-02
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Maximum solder ball diameter
measured parallel to Datum A.
4. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
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