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參數(shù)資料
| 型號： | TSPC603R |
| 英文描述： | TSPC603R [Updated 4/02. 44 Pages] 32-bit RISC Microprocessor. 166-300 MHz |
| 中文描述： | TSPC603R [更新4 / 02。 44頁] 32位RISC微處理器。 166-300兆赫 |
| 文件頁數(shù)： | 12/44頁 |
| 文件大小： | 636K |
| 代理商： | TSPC603R |
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12
TSPC603R
2125A
–
HIREL
–
04/02
The thermal resistance of the thermal interface material (R
cs
) is typically about
1
°
C/Watt.
Assuming a T
a
of 85
°
C and a consumption (P) of 3.6 Watts, the junction temperature of
the device would be as follow:
T
j =
85
°
C + (0.095
°
C/Watt + 1
°
C/Watt +R
sa
) * 3.5 Watts.
For the Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (R
sa
)
versus airflow velocity is shown in Figure 4.
Figure 4.
CBGA Thermal Management Example
Assuming an air velocity of 1.0 m/sec, the associated overall thermal resistance and
junction temperature, found in Table 7 will result.
Vendors such as Aavid Engineering Inc., Thermalloy, and Wakefield Engineering can
supply heat sinks with a wide range of thermal performance.
Power Consideration
The PowerPC 603r is a microprocessor specifically designed for low-power operation.
As the 603e microprocessor version, the 603r provides both automatic and pro-
gram-controllable power reduction modes for progressive reduction of power
consumption. This chapter describes the hardware support provided by the 603r for
power management.
Dynamic Power Management
Dynamic power management automatically powers up and down the individual execu-
tion units of the 603r, based upon the contents of the instruction stream. For example, if
no floating-point instructions are being executed, the floating-point unit is automatically
powered down. Power is not actually removed from the execution unit; instead, each
execution unit has an independent clock input, which is automatically controlled on a
clock-by-clock basis. Since CMOS circuits consume negligible power when they are not
switching, stopping the clock to an execution unit effectively eliminates its power con-
sumption. The operation of DPM is completely transparent to software or any external
hardware. Dynamic power management is enabled by setting bit 11 in HID0 on
power-up, of following HRESET.
0
1
2
3
4
5
6
7
0
1
2
3
H
Approach air velocity (m/sec)
Rsa (
C/W)
Table 7.
Thermal Resistance and Junction Temperature
Configuration
R
ja
(
°
C/W)
T
j
(
°
C)
With 2328B heat sink
5.0
106
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