參數(shù)資料
型號(hào): AD9548BCPZ
廠商: Analog Devices Inc
文件頁數(shù): 11/112頁
文件大小: 0K
描述: IC CLOCK GEN/SYNCHRONIZR 88LFCSP
產(chǎn)品變化通告: AD9548 Mask Change 20/Oct/2010
標(biāo)準(zhǔn)包裝: 1
類型: 時(shí)鐘/頻率發(fā)生器,同步器
PLL:
主要目的: 以太網(wǎng),SONET/SDH,Stratum
輸入: CMOS,LVDS,LVPECL
輸出: CMOS,LVDS,LVPECL
電路數(shù): 1
比率 - 輸入:輸出: 1:1
差分 - 輸入:輸出: 是/是
頻率 - 最大: 750kHz
電源電壓: 1.71 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 88-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 88-LFCSP-VQ(12x12)
包裝: 托盤
AD9548
Data Sheet
Rev. E | Page 108 of 112
THERMAL PERFORMANCE
Table 156. Thermal Parameters for the AD9548 88-Lead LFCSP Package
Symbol
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board1
Value2
Unit
θJA
Junction-to-ambient thermal resistance, 0.0 m/s airflow per JEDEC JESD51-2 (still air)
18
°C/W
θJMA
Junction-to-ambient thermal resistance, 1.0 m/s airflow per JEDEC JESD51-6 (moving air)
16
°C/W
θJMA
Junction-to-ambient thermal resistance, 2.5 m/s airflow per JEDEC JESD51-6 (moving air)
14
°C/W
θJB
Junction-to-board thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-8 (moving air)
9
°C/W
θJC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
1.0
°C/W
ΨJT
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
0.1
°C/W
1
The exposed pad on the bottom of the package must be soldered to ground to achieve the specified thermal performance.
2
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
The AD9548 is specified for a case temperature (TCASE). To
ensure that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction tempera-
ture on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
the top center of the package.
ΨJT is the value as indicated in Table 156.
PD is the power dissipation (see the Power Dissipation section).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approx-
imation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
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