參數(shù)資料
型號(hào): ADSP-21469KBCZ-4
廠商: Analog Devices Inc
文件頁(yè)數(shù): 27/72頁(yè)
文件大?。?/td> 0K
描述: IC DSP 32/40BIT 450MHZ 324BGA
產(chǎn)品變化通告: Pin Function Change 08/Mar/2012
標(biāo)準(zhǔn)包裝: 1
系列: SHARC®
類型: 浮點(diǎn)
接口: DAI,DPI,EBI/EMI,I²C,SCI,SPI,SSP,UART/USART
時(shí)鐘速率: 450MHz
非易失內(nèi)存: 外部
芯片上RAM: 5Mb
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.10V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 324-BGA,CSPBGA
供應(yīng)商設(shè)備封裝: 324-CSPBGA
包裝: 托盤
ADSP-21469
Rev. 0
|
Page 33 of 72
|
June 2010
AMI Read
Use these specifications for asynchronous interfacing to memo-
ries. Note that timing for AMI_ACK, AMI_DATA, AMI_RD,
AMI_WR, and strobe timing parameters only apply to asyn-
chronous access mode.
Table 30. Memory Read
Parameter
Min
Max
Unit
Timing Requirements
tDAD
Address, Selects Delay to Data Valid1, 2
W + tDDR2_CLK –5.4
ns
tDRLD
AMI_RD Low to Data Valid1
W – 3.2
ns
tSDS
Data Setup to AMI_RD High
2.5
ns
tHDRH
Data Hold from AMI_RD High3, 4
0ns
tDAAK
AMI_ACK Delay from Address, Selects2, 5
tDDR2_CLK –9.5 + W
ns
tDSAK
AMI_ACK Delay from AMI_RD Low4
W – 7.0
ns
Switching Characteristics
tDRHA
Address Selects Hold After AMI_RD High
RH + 0.20
ns
tDARL
Address Selects to AMI_RD Low2
tDDR2_CLK – 3.8
ns
tRW
AMI_RD Pulse Width
W – 1.4
ns
tRWR
AMI_RD High to AMI_RD Low
HI + tDDR2_CLK – 1
ns
W = (number of wait states specified in AMICTLx register) × tDDR2_CLK.
RHC = (number of Read Hold Cycles specified in AMICTLx register) × tDDR2_CLK
Where PREDIS = 0
HI = RHC: Read to Read from same bank
HI = RHC + IC: Read to Read from different bank
HI = RHC + Max (IC, (4 × tDDR2_CLK)): Read to Write from same or different bank
Where PREDIS = 1
HI = RHC + Max(IC, (4 × tDDR2_CLK)): Read to Write from same or different bank
HI = RHC + (3 × tDDR2_CLK): Read to Read from same bank
HI = RHC + Max(IC, (3 × tDDR2_CLK)): Read to Read from different bank
IC = (number of idle cycles specified in AMICTLx register) × tDDR2_CLK
H = (number of hold cycles specified in AMICTLx register) × tDDR2_CLK
1 Data delay/setup: System must meet tDAD, tDRLD, or tSDS.
2 The falling edge of AMI_MSx, is referenced.
3 Note that timing for AMI_ACK, AMI_DATA, AMI_RD, AMI_WR, and strobe timing parameters only apply to asynchronous access mode.
4 Data hold: User must meet tHDRH in asynchronous access mode. See Test Conditions on Page 58 for the calculation of hold times given capacitive and dc loads.
5 AMI_ACK delay/setup: User must meet t
DAAK, or tDSAK, for deassertion of AMI_ACK (low).
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