參數(shù)資料
型號: ADSP-21469KBCZ-4
廠商: Analog Devices Inc
文件頁數(shù): 66/72頁
文件大?。?/td> 0K
描述: IC DSP 32/40BIT 450MHZ 324BGA
產(chǎn)品變化通告: Pin Function Change 08/Mar/2012
標(biāo)準(zhǔn)包裝: 1
系列: SHARC®
類型: 浮點(diǎn)
接口: DAI,DPI,EBI/EMI,I²C,SCI,SPI,SSP,UART/USART
時鐘速率: 450MHz
非易失內(nèi)存: 外部
芯片上RAM: 5Mb
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.10V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 324-BGA,CSPBGA
供應(yīng)商設(shè)備封裝: 324-CSPBGA
包裝: 托盤
ADSP-21469
Rev. 0
|
Page 69 of 72
|
June 2010
OUTLINE DIMENSIONS
The ADSP-21469 processor is available in a 19 mm by 19 mm
CSP_BGA lead-free package.
SURFACE-MOUNT DESIGN
The following table is provided as an aid to PCB design. For
industry-standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface-Mount Design and Land Pat-
tern Standard.
Figure 60. 324-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
(BC-324-1)
Dimensions shown in millimeters
*COMPLIANT TO JEDEC STANDARDS MO-192-AAG-1 WITH
THE EXCEPTION TO PACKAGE HEIGHT.
1.00
BSC
1.00
REF
A
B
C
D
E
F
G
9
8
11
10
13
12
7
6
5
42
31
BOTTOM VIEW
17.00
BSC SQ
H
J
K
L
M
N
P
R
T
U
V
0.50 NOM
0.45 MIN
DETAIL A
TOP VIEW
DETAIL A
COPLANARITY
0.20
0.70
0.60
0.50
BALL DIAMETER
SEATING
PLANE
19.10
19.00 SQ
18.90
A1 BALL
CORNER
A1 BALL
CORNER
*1.80
1.71
1.56
1.31
1.21
1.11
15
14
17
16
18
Package
Package Ball Attach Type
Package Solder Mask
Opening
Package Ball Pad Size
324-Ball CSP_BGA (BC-324-1)
Solder Mask Defined
0.43 mm diameter
0.6 mm diameter
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