參數(shù)資料
型號: HSP3824VI
廠商: Harris Corporation
元件分類: 基帶處理器
英文描述: Direct Sequence Spread Spectrum Baseband Processor
中文描述: 直接序列擴頻基帶處理器
文件頁數(shù): 41/41頁
文件大?。?/td> 276K
代理商: HSP3824VI
41
HSP3824
D
D1
E E1
-A-
PIN 1
A2A1
A
11
o
-13
o
11
o
-13
o
0
o
-7
o
0.020
0
o
MIN
L
PLANE
B
0.004/0.008
0.09/0.20
WITH PLATING
BASE METAL
SEATING
0.004/0.006
0.09/0.16
B1
-B-
e
0.003
0.08
A-B
S
D
S
C
M
0.08
0.003
-C-
-D-
-H-
0.25
0.010
GAGE
PLANE
Thin Plastic Quad Flatpack Packages (TQFP)
1
Q48.7x7
(JEDEC MO-136AE ISSUE C)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.005
0.05
0.15
-
A2
0.038
0.041
0.95
1.05
-
B
0.007
0.010
0.17
0.27
6
B1
0.007
0.009
0.17
0.23
-
D
0.347
0.362
8.80
9.20
3
D1
0.268
0.283
6.80
7.20
4, 5
E
0.347
0.362
8.80
9.20
3
E1
0.268
0.283
6.80
7.20
4, 5
L
0.018
0.029
0.45
0.75
-
N
48
48
7
e
0.020 BSC
0.50 BSC
-
Rev. 0 4/95
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane
4. Dimensions D1 and E1 to be determined at datum plane
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum B dimension by more than 0.08mm (0.003 inch).
7. “N” is the number of terminal positions.
.
.
-C-
-H-
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