參數(shù)資料
型號(hào): IBM21P100BGB
元件分類: 總線控制器
英文描述: PCI BUS CONTROLLER, PBGA304
封裝: 31 X 31 MM, HEAT SINK, PLASTIC, BGA-304
文件頁數(shù): 39/140頁
文件大小: 2032K
代理商: IBM21P100BGB
IBM21P100BGB
IBM 133 PCI-X Bridge R1.1
ppb11_elec.fm.03
July 9, 2001
Electrical Information
Page 125 of 131
10. Electrical Information
This section specifies the electrical and thermal behavior of the IBM 133 PCI-X Bridge R1.1 in a number of
key areas.
10.1 PCI / PCI-X Specification Conformance
Most of the IBM 133 PCI-X Bridge R1.1 interface signals are delineated by the PCI / PCI-X Specifications.
These interface signals conform to electrical requirements of the specification documents; hence, that infor-
mation is not duplicated here. The IBM 133 PCI-X Bridge R1.1 uses the 3.3 V signaling environment, which
implies thatitis not a 5V-tolerant device.
10.2 Absolute Maximum Ratings
Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions
outside of the limits indicated in this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect reliability.
Table 20: Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDD
Core Logic Power Supply Voltage
V
VDD2
I/O Power Supply Voltage
V
VIN
Input Voltage
V
VOUT
Output Voltage
V
TA
Operating Temperature (ambient)
0 to +70
°C
TJ
Maximum Junction Temperature
+125
°C
TSTG
Storage Temperature
-55 to +125
°C
PWC
Worst Case Power Dissipation
4.0
W
IOUT
Short Circuit Output Current
mA
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