參數(shù)資料
型號： MT48LC32M4A2P-7ELIT:G
元件分類： DRAM
英文描述： 32M X 4 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
封裝： 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-54
文件頁數(shù)： 72/74頁
文件大?。?/td> 2385K
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
their respective owners.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
set forth herein. Although considered final, these specifications are subject to change, as further product development and
data characterization sometimes occur.
128Mb: x4, x8, x16 SDRAM
Package Dimensions
PDF: 09005aef8091e66d/Source: 09005aef8091e625
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128MSDRAM_2.fm - Rev. N 1/09 EN
74
1999 Micron Technology, Inc. All rights reserved.
Figure 58:
54-Ball VFBGA “F4/B4” Package (x16 device), 8mm x 8mm
Notes:
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.40mm SMD.
3. Topside part marking decoder can be found at http://www.micron.com/decoder.
BALL A1 ID
0.65 ±0.05
SEATING PLANE
0.10 C
C
1.00 MAX
BALL A9
0.80
TYP
0.80 TYP
3.20
6.40
8.00 ±0.10
4.00 ±0.05
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
54X 0.45 ±0.05
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS:
0.40
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE MATERIAL: PLASTIC LAMINATE
6.40
3.20
4.00 ±0.05
8.00 ±0.10
CL
BALL A1 ID
BALL A1
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