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Contents
TMS320DM6443
Digital Media System-on-Chip
SPRS282E–DECEMBER 2005–REVISED MARCH 2007
1
Digital Media System-on-Chip (DMSoC)
............
1
1.1
1.2
1.3
Revision History
...............................................
7
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
3
3.1
3.2
3.3
3.4
3.5
3.6
4
4.1
5
5.1
Absolute Maximum Ratings Over Operating Case
Temperature Range
(Unless Otherwise Noted)
..........................
84
5.2
5.3
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted)
............
86
6
6.1
6.2
Parameter Information
..............................
87
Recommended Clock and Control Signal Transition
Behavior
.............................................
88
Power Supplies
......................................
88
Reset
................................................
98
External Clock Input From MXI/CLKIN Pin
........
101
Clock PLLs
.........................................
104
Interrupts
...........................................
111
General-Purpose Input/Output (GPIO)
.............
118
Enhanced Direct Memory Access (EDMA)
Controller
...........................................
121
External Memory Interface (EMIF)
.................
133
ATA/CF
............................................
141
MMC/SD/SDIO
.....................................
154
Video Processing Sub-System (VPSS) Overview
.
157
Host-Port Interface (HPI)
...........................
173
USB 2.0
...........................................
176
Universal Asynchronous Receiver/Transmitter
(UART)
.............................................
185
Serial Port Interface (SPI)
..........................
188
Inter-Integrated Circuit (I2C)
.......................
192
Audio Serial Port (ASP)
............................
196
Ethernet Media Access Controller (EMAC)
........
200
Management Data Input/Output (MDIO)
...........
206
Timer
...............................................
208
Pulse Width Modulator (PWM)
.....................
210
VLYNQ
.............................................
212
IEEE 1149.1 JTAG
................................
216
Mechanical Packaging and Orderable
Information
.............................................
218
7.1
7.2
Features
..............................................
1
Description
............................................
2
Functional Block Diagram
............................
5
6.3
6.4
6.5
6.6
6.7
6.8
6.9
Device Overview
.........................................
9
Device Characteristics
................................
9
Device Compatibility
.................................
10
ARM Subsystem
....................................
10
DSP Subsystem
.....................................
15
Memory Map Summary
.............................
19
Pin Assignments
....................................
22
Terminal Functions
..................................
27
Device Support
......................................
56
Device Configurations
.................................
59
System Module Registers
...........................
59
Power Considerations
...............................
59
Bootmode
...........................................
60
Configurations at Reset
.............................
64
Configurations After Reset
..........................
67
Emulation Control
...................................
80
System Interconnect
...................................
82
System Interconnect Block Diagram
................
83
Device Operating Conditions
........................
84
6.10
6.11
6.12
6.13
6.14
6.15
6.16
6.17
6.18
6.19
6.20
6.21
6.22
6.23
6.24
6.25
Recommended Operating Conditions
...............
85
7
Thermal Data for ZWT
.............................
218
Packaging Information
.............................
218
Peripheral and Electrical Specifications
...........
87
Contents
6
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