參數(shù)資料
型號: XC3S400AN-5FTG256C
廠商: Xilinx Inc
文件頁數(shù): 109/123頁
文件大小: 0K
描述: IC FPGA SPARTAN-3AN 256FTBGA
標(biāo)準(zhǔn)包裝: 90
系列: Spartan®-3AN
LAB/CLB數(shù): 896
邏輯元件/單元數(shù): 8064
RAM 位總計(jì): 368640
輸入/輸出數(shù): 195
門數(shù): 400000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FTBGA
Spartan-3AN FPGA Family: Pinout Descriptions
DS557 (v4.1) April 1, 2011
Product Specification
86
User I/Os by Bank
Table 71 and Table 72 indicate how the available user-I/O pins are distributed between the four I/O banks on the FTG256
package. The AWAKE pin is counted as a dual-purpose I/O. The XC3S50AN FPGA in the FTG256 package has 51
unconnected balls, labeled with an N.C. type. These pins are also indicated in Figure 20.
Table 71: User I/Os Per Bank on XC3S50AN in the FTG256 Package
Package
Edge
I/O Bank
Maximum I/Os
All Possible I/O Pins by Type
I/O
INPUT
DUAL
VREF
CLK
Top
0
40
21
7
1
3
8
Right
1
32
12
5
4
3
8
Bottom
2
40
5
2
21
6
Left
3
32
15
6
0
3
8
Total
144
53
20
26
15
30
Table 72: User I/Os Per Bank on XC3S200AN and XC3S400AN in the FTG256 Package
Package
Edge
I/O Bank
Maximum I/Os
All Possible I/O Pins by Type
I/O
INPUT
DUAL
VREF
CLK
Top
0
47
27
6
1
5
8
Right
1
50
1
6
30
5
8
Bottom
2
48
11
2
21
6
8
Left
3
50
30
7
0
5
8
Total
195
69
21
52
21
32
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