參數資料
型號： XC3S400AN-5FTG256C
廠商： Xilinx Inc
文件頁數： 69/123頁
文件大小： 0K
描述： IC FPGA SPARTAN-3AN 256FTBGA
標準包裝： 90
系列： Spartan®-3AN
LAB/CLB數： 896
邏輯元件/單元數： 8064
RAM 位總計： 368640
輸入/輸出數： 195
門數： 400000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 256-LBGA
供應商設備封裝： 256-FTBGA
Spartan-3AN FPGA Family: Introduction and Ordering Information
DS557 (v4.1) April 1, 2011
Product Specification
5
Sector-based data protection and security features
Sector Protect: Write- and erase-protect a sector
(changeable)
Sector Lockdown: Sector data is unchangeable
(permanent)
128-byte Security Register
Separate from FPGA’s unique Device DNA
identifier
64-byte factory-programmed identifier unique to
the in-system Flash memory
64-byte one-time programmable,
user-programmable field
100,000 Program/Erase cycles
20-year data retention
Comprehensive programming support
In-system prototype programming via JTAG using
Xilinx Platform Cable USB and iMPACT software
Product programming support using BPM
Microsystems programmers with appropriate
programming adapter
Design examples demonstrating in-system
programming from a Spartan-3AN FPGA
application
I/O Capabilities
The Spartan-3AN FPGA SelectIO interface supports many
popular single-ended and differential standards. Table 4
shows the number of user I/Os as well as the number of
differential I/O pairs available for each device/package
combination. Some of the user I/Os are unidirectional,
input-only pins as indicated in Table 4.
Spartan-3AN FPGAs support the following single-ended
standards:
3.3V low-voltage TTL (LVTTL)
Low-voltage CMOS (LVCMOS) at 3.3V, 2.5V, 1.8V,
1.5V, or 1.2V
3.3V PCI at 33 MHz or 66 MHz
HSTL I, II, and III at 1.5V and 1.8V, commonly used in
memory applications
SSTL I and II at 1.8V, 2.5V, and 3.3V, commonly used
for memory applications
Spartan-3AN FPGAs support the following differential
standards:
LVDS, mini-LVDS, RSDS, and PPDS I/O at 2.5V or
3.3V
Bus LVDS I/O at 2.5V
TMDS I/O at 3.3V
Differential HSTL and SSTL I/O
LVPECL inputs at 2.5V or 3.3V
Table 4: Available User I/Os and Differential (Diff) I/O Pairs
Package(1)
TQ144
TQG144
FT256
FTG256
FG400
FGG400
FG484
FGG484
FG676
FGG676
Body Size (mm)
20 x 20(2)
17 x17
21x 21
23x23
27 x 27
Device(3)
User
Diff
User
Diff
User
Diff
User
Diff
User
Diff
XC3S50AN
108(4)
(7)
50
(24)
144
(32)
64
(32)
–
XC3S200AN
–
195
(35)
90
(50)
–
XC3S400AN
–
195
(35)
90
(50)
311
(63)
142
(78)
–
XC3S700AN
–
372
(84)
165
(93)
–
XC3S1400AN
–
375
(87)
165
(93)
502
(94)
227
(131)
Notes:
1.
See Pb and Pb-Free Packaging, page 7 for details on Pb and Pb-free packaging options.
2.
The footprint for the TQ(G)144 (22 mm x 22 mm) package is larger than the package body.
3.
Each Spartan-3AN FPGA has a pin-compatible Spartan-3A FPGA equivalent, although Spartan-3A FPGAs do not have internal SPI flash
and offer more part/package combinations.
4.
The number shown in bold indicates the maximum number of I/O and input-only pins. The number shown in (italics) indicates the number
of input-only pins. The differential (Diff) input-only pin count includes both differential pairs on input-only pins and differential pairs on I/O pins
within I/O banks that are restricted to differential inputs.
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