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參數(shù)資料
| 型號： | XPC755BRX400LE |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 40/52頁 |
| 文件大?。?/td> | 1274K |
| 代理商： | XPC755BRX400LE |
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MPC755 RISC Microprocessor Hardware Specifications
MOTOROLA
System Design Information
clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in
Figure 25 is common to all known emulators.
The QACK signal shown in Figure 24 is usually connected to the PCI bridge chip in a system and is an input
to the MPC755 informing it that it can go into the quiescent state. Under normal operation this occurs during
a low-power mode selection. In order for COP to work, the MPC755 must see this signal asserted (pulled
down). While shown on the COP header, not all emulator products drive this signal. If the product does not,
a pull-down resistor can be populated to assert this signal. Additionally, some emulator products implement
open-drain type outputs and can only drive QACK asserted; for these tools, a pull-up resistor can be
implemented to ensure this signal is deasserted when it is not being driven by the tool. Note that the pull-up
and pull-down resistors on the QACK signal are mutually exclusive and it is never necessary to populate
both in a system. To preserve correct power-down operation, QACK should be merged via logic so that it
also can be driven by the PCI bridge.
1.8.8
Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent upon the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—adhesive, spring clip to holes in the
printed-circuit board or package, and mounting clip and screw assembly; see Figure 25. This spring force
should not exceed 5.5 pounds of force.
Figure 25
describes the package exploded cross-sectional view with several heat sink options.
Figure 25. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC755. There are
several commercially-available heat sinks for the MPC755 provided by the following vendors:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
Adhesive or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
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