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| 型號： | XPC755BRX400LE |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 44/52頁 |
| 文件大?。?/td> | 1274K |
| 代理商： | XPC755BRX400LE |
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44
MPC755 RISC Microprocessor Hardware Specifications
MOTOROLA
System Design Information
1.8.8.3
Heat Sink Selection Example
This section provides a heat sink selection example using one of the commercially-available heat sinks. For
preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j
= T
a
+ T
r
+ (
θ
jc
+
θ
int
+
θ
sa
)
×
P
d
where:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
θ
jc
is the junction-to-case thermal resistance
θ
int
is the adhesive or interface material thermal resistance
θ
sa
is the heat sink base-to-ambient thermal resistance
P
d
is the power dissipated by the device
During operation the die-junction temperatures (T
j
) should be maintained less than the value specified in
Table 3. The temperature of the air cooling the component greatly depends on the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (T
a
) may range from 30° to 40°C. The air temperature rise within a cabinet (T
r
) may be in the
range of 5° to 10°C. The thermal resistance of the thermal interface material (
θ
int
) is typically about 1°C/W.
Assuming a T
a
of 30°C, a T
r
of 5°C, a CBGA package R
θ
jc
< 0.1, and a power consumption (P
d
) of 5.0 W,
the following expression for T
j
is obtained:
Die-junction temperature:
T
j
= 30°C + 5°C + (0.1°C/W + 1.0°C/W +
θ
sa
)
×
5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa
) versus airflow
velocity is shown in Figure 28.
Assuming an air velocity of 0.5 m/s, we have an effective R
sa
of 7°C/W, thus
T
j
= 30°C + 5°C + (0.1°C/W + 1.0°C/W + 7°C/W)
×
5.0 W,
resulting in a die-junction temperature of approximately 76°C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, The Bergquist Company, IERC, Chip
Coolers, and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, and may or
may not need airflow.
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