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| 型號(hào)： | MT47H128M8HQ-187ELAT:E |
| 元件分類： | DRAM |
| 英文描述： | 128M X 8 DDR DRAM, 0.35 ns, PBGA60 |
| 封裝： | 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 |
| 文件頁(yè)數(shù)： | 13/133頁(yè) |
| 文件大?。?/td> | 9170K |
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Automotive Temperature
The automotive temperature (AT) option, if offered, has two simultaneous require-
ments: ambient temperature surrounding the device cannot be less than –40°C or
greater than +105°C, and the case temperature cannot be less than –40°C or greater
than +105°C. JEDEC specifications require the refresh rate to double when TC exceeds
+85°C; this also requires use of the high-temperature self refresh option. Additionally,
ODT resistance and the input/output impedance must be derated when TC is < 0°C or >
+85°C.
General Notes
The functionality and the timing specifications discussed in this data sheet are for the
DLL-enabled mode of operation.
Throughout the data sheet, the various figures and text refer to DQs as “DQ.” The DQ
term is to be interpreted as any and all DQ collectively, unless specifically stated oth-
erwise. Additionally, the x16 is divided into 2 bytes: the lower byte and the upper byte.
For the lower byte (DQ0–DQ7), DM refers to LDM and DQS refers to LDQS. For the
upper byte (DQ8–DQ15), DM refers to UDM and DQS refers to UDQS.
Complete functionality is described throughout the document, and any page or dia-
gram may have been simplified to convey a topic and may not be inclusive of all
requirements.
Any specific requirement takes precedence over a general statement.
1Gb: x4, x8, x16 DDR2 SDRAM
Functional Description
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. S 10/09 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MT47H128M8HQ-25AT | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:DDR2 SDRAM |
| MT47H128M8HQ-25EAT | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:DDR2 SDRAM |
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