- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄224506 > MT47H128M8HQ-187ELAT:E 128M X 8 DDR DRAM, 0.35 ns, PBGA60 PDF資料下載
參數(shù)資料
| 型號(hào)： | MT47H128M8HQ-187ELAT:E |
| 元件分類： | DRAM |
| 英文描述： | 128M X 8 DDR DRAM, 0.35 ns, PBGA60 |
| 封裝： | 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 |
| 文件頁(yè)數(shù)： | 6/133頁(yè) |
| 文件大?。?/td> | 9170K |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)當(dāng)前第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)
5. tQH is derived from tHP: tQH = tHP - tQHS.
6. The data valid window is derived for each DQS transition and is tQH - tDQSQ.
7. DQ8, DQ9, DQ10, D11, DQ12, DQ13, DQ14, or DQ15.
Figure 56: Data Output Timing – tAC and tDQSCK
CK
CK#
DQS#/DQS or
LDQS#/LDQS/UDQ#/UDQS3
T01
T1
T2
T3
T3n
T4
T4n
T5
T5n
T6
T6n
T7
tRPST
tDQSCK2 (MIN)
tDQSCK2 (MAX)
DQ (last data valid)
DQ (first data valid)
All DQs collectively4
tAC5 (MIN)
tAC5 (MAX)
tLZ (MIN)
tHZ (MAX)
T3
T3n
T4n
T5n
T6n
T3n
T4n
T5n
T6n
T4
T5
T6
T3
T4
T5
T6
T4
tHZ (MAX)
tLZ (MIN)
tRPRE
Notes: 1. READ command with CL = 3, AL = 0 issued at T0.
2. tDQSCK is the DQS output window relative to CK and is the long-term component of
DQS skew.
3. DQ transitioning after DQS transitions define tDQSQ window.
4. All DQ must transition by tDQSQ after DQS transitions, regardless of tAC.
5. tAC is the DQ output window relative to CK and is the “l(fā)ong term” component of DQ
skew.
6. tLZ (MIN) and tAC (MIN) are the first valid signal transitions.
7. tHZ (MAX) and tAC (MAX) are the latest valid signal transitions.
8. I/O balls, when entering or exiting High-Z, are not referenced to a specific voltage level,
but to when the device begins to drive or no longer drives, respectively.
WRITE
WRITE bursts are initiated with a WRITE command. DDR2 SDRAM uses WL equal to RL
minus one clock cycle (WL = RL - 1CK) (see READ (page 74)). The starting column and
bank addresses are provided with the WRITE command, and auto precharge is either
enabled or disabled for that access. If auto precharge is enabled, the row being accessed
is precharged at the completion of the burst.
Note:
For the WRITE commands used in the following illustrations, auto precharge is disabled.
During WRITE bursts, the first valid data-in element will be registered on the first rising
edge of DQS following the WRITE command, and subsequent data elements will be reg-
istered on successive edges of DQS. The LOW state on DQS between the WRITE com-
mand and the first rising edge is known as the write preamble; the LOW state on DQS
following the last data-in element is known as the write postamble.
The time between the WRITE command and the first rising DQS edge is WL ±tDQSS.
Subsequent DQS positive rising edges are timed, relative to the associated clock edge,
as ±tDQSS. tDQSS is specified with a relatively wide range (25% of one clock cycle). All of
1Gb: x4, x8, x16 DDR2 SDRAM
WRITE
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. S 10/09 EN
103
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MT48LC2M32B1TG-7 | 2M X 32 SYNCHRONOUS DRAM, 5.5 ns, PDSO86 |
| MT48LC32M4A2P-7ELIT:G | 32M X 4 SYNCHRONOUS DRAM, 5.4 ns, PDSO54 |
| MT55L256L18FT-12TR | 256K X 18 ZBT SRAM, 9 ns, PQFP100 |
| MT55L256L32FT-12 | 256K X 32 ZBT SRAM, 9 ns, PQFP100 |
| MT55L512V18PF-6 | 512K X 18 ZBT SRAM, 3.5 ns, PBGA165 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MT47H128M8HQ-25AT | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:DDR2 SDRAM |
| MT47H128M8HQ-25EAT | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:DDR2 SDRAM |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。