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| 型號： | pentium II xeon processor |
| 廠商： | Intel Corp. |
| 英文描述： | pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器) |
| 中文描述： | 奔騰II至強處理器400和450兆赫（工作頻率400和450兆赫茲奔二處理器） |
| 文件頁數(shù)： | 53/97頁 |
| 文件大?。?/td> | 978K |
| 代理商： | PENTIUM II XEON PROCESSOR |
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E
PENTIUM II XEON PROCESSOR AT 400 AND 450 MHZ
53
12/15/98 5:14 PM 24377002.doc
Table 38. Thermal Design Power1
Processor
Core
Frequency
(MHz)
L2
Cache
Size
Core
Power
(W)
L2
Power
(W)
AGTL+
Power
4
(W)
Processor
Power
2
(W)
Thermal
Plate
Power
3
(W)
Min
T
(°C)
Max
T
(°C)
Min
T
COVER
Max
T
COVER
FMB
5
-
35.2
21.0
2
50.0
50.0
0
75
0
75
400
512K
23.3
7.5
2
30.8
30.8
0
75
0
75
400
1M
23.3
15.0
2
38.1
38.1
0
75
0
75
450
512K
26.2
8.5
2
34.5
34.5
0
75
0
75
450
1M
26.2
17.0
2
42.8
42.8
0
75
0
75
450
2M
26.2
21.0
2
46.7
46.7
0
75
0
75
NOTES:
1.
2.
These values are specified at nominal V
CC
CORE
for the processor core and nominal V
CCL2
= 2.5 V for the L2 cache.
Processor power indicates the worst case power that can be dissipated by the entire processor. This value will be
determined after the product has been characterized. It is not possible for the AGTL+ bus, the L2 cache and the processor
core to all be at full power simultaneously.
The combined power that dissipates through the thermal plate is the thermal plate power. This value will be determined
after the product has been characterized. The value shown follows the expectation that virtually all of the power will
dissipate through the thermal plate.
AGTL+ power is the worst case power dissipated in the termination resistors for the AGTL+ bus.
“FMB” is a suggested design guideline for a flexible motherboard design. Notice that worst case L2 power and worst case
processor power do not occur on the same processor.
3.
4.
5.
5.1.1.
POWER DISSIPATION
Table 38 provides the thermal design power
dissipation for Pentium II Xeon processors. While the
processor core dissipates the majority of the thermal
power, the system designer should also be aware of
the thermal power dissipated by the second level
cache. Systems should design for the highest
possible thermal power, even if a processor with
lower frequency or smaller second level cache is
planned. The thermal plate is the attach location for
all thermal solutions. The maximum temperature for
the entire thermal plate surface is shown in Table 38.
The processor power is dissipated through the
thermal plate and other paths. The power dissipation
is a combination of power from the processor core,
the second level cache and the AGTL+ bus
termination resistors. The overall system thermal
design must comprehend the total processor power.
The combined power from the processor core and
the second level cache that dissipates through the
thermal plate is the thermal plate power. The
heatsink should be designed to dissipate the thermal
plate power.
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