PENTIUM II XEON PROCESSOR AT 400 AND 450 MHZ
E
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7.2.2.
BOXED PROCESSOR HEATSINK
WEIGHT
The boxed processor heatsink will not weigh more
than 350 grams.
7.2.3.
BOXED PROCESSOR RETENTION
MECHANISM
The boxed Pentium II Xeon processor requires a
retention mechanism that supports and secures
the Single Edge Contact Cartridge (S.E.C.C.) in
the 330-contact slot connector. An S.E.C.C.
retention mechanism is not provided with the
boxed processor. Motherboards designed for use
by system integrators should include a retention
mechanism
and
appropriate
instructions. The boxed Pentium II Xeon processor
does not require additional heatsink supports.
Heatsink supports will not ship with the boxed
Pentium II Xeon processor.
installation
7.3.
Thermal Specifications
This section describes the cooling requirements of
the heatsink solution utilized by the boxed
processor.
7.3.1.
BOXED PROCESSOR COOLING
REQUIREMENTS
The boxed processor passive heatsink requires
airflow horizontally across the heatsink to cool the
processor. The boxed processor heatsink will keep
the processor thermal plate temperature, T
PLATE
,
within the specifications, provided adequate airflow
is directed into the system chassis, across the
heatsink and out of the system chassis. System
integrators should perform thermal testing using
thermocouples (see Section 5.2.) to evaluate the
thermal efficiency of the system. Alternately,
system integrators may use software to monitor
the thermal information available via the Processor
Information ROM and information from the thermal
sensor (see Section 4.3.) to evaluate the thermal
efficiency of the system.
7.3.2.
THERMAL EVALUATION
Given the complex and unique nature of
motherboard layouts, and the special chassis
required to support them, thermal performance
may vary greatly with each motherboard/chassis
combination. Motherboard manufacturers must
evaluate
solutions for their specific designs, particularly
designs that are proprietary or have nonstandard
layouts. Such thermal solutions must take all
system components into account. The power
requirements of all processors that will be
supported
by
the
motherboard
accommodated.
and
recommend
effective
thermal
should
be
8.0.
INTEGRATION TOOLS
The integration tool set for Pentium II Xeon
processor system designs will include an In-Target
Probe (ITP) for program execution control,
register/memory/IO
access,
control. This tool provides functionality commonly
associated with debuggers and emulators. The ITP
uses the on-chip debug features of the Pentium II
Xeon processor to provide program execution
control. Use of the ITP will not affect the high
speed operations of the processor signals,
ensuring the system can operate at full speed with
the ITP attached.
and
breakpoint
This document describes the ITP as well as a
number of technical issues that must be taken into
account when including the ITP and logic analyzer
interconnect tools in a debug strategy. Although
the tool description that follows is specific to early
tools available from Intel, similar tools may also be
provided in the future by third-party vendors. Thus,
the tools mentioned should not be considered as
Intel’s tools, but as debug tools in the generic
sense.
In general, the information in this chapter may be
used as a basis for including integration tools in
any Pentium II Xeon processor-based system
design. The logic analyzer interconnect tool keep-
out zones described in this chapter should be used
as general guidelines for Pentium II Xeon
processor system design.
8.1.
In-Target Probe (ITP) for
Pentium
II Xeon
Processors
An In-Target Probe (ITP) for Pentium II Xeon
processors is a debug tool which allows access to
on-chip debug features via a small port on the
system board called the debug port. The ITP
communicates to the processor through the debug
port using a combination of hardware and
software. The software is Windows NT 4.0 running