參數(shù)資料
型號: HC805P18GRS
英文描述: 68HC805P18 Technical Data
中文描述: 68HC805P18技術數(shù)據(jù)
文件頁數(shù): 96/111頁
文件大?。?/td> 748K
代理商: HC805P18GRS
GENERAL RELEASE SPECIFICATION
MOTOROLA
13-2
ELECTRICAL SPECIFICATIONS
MC68HC805P18
Rev. 1.0
8
2
3
4
5
6
7
8
9
10
11
12
13
14
A
16
17
18
19
20
13.4 Thermal Characteristics
13.5 Power Considerations
The average chip-junction temperature, T
J
, in
°
C, can be obtained from:
T
J
= T
A
+ (P
D
×
θ
JA
)
(1)
where:
T
A
= Ambient temperature,
°
C
θ
JA
= Package thermal resistance, junction to ambient,
°
C/W.
P
D
= P
INT
+ P
I
/
O
P
INT
= I
DD
×
V
DD
watts (chip internal power)
P
I
/
O
= Power dissipation on input and output pins (user-determined)
For most applications, P
I
/
O
P
INT
and can be neglected.
The following is an approximate relationship between P
D
and T
J
(neglecting P
I
/
O
):
P
D
= K
÷
(T
J
+ 273
°
C)
(2)
Solving equations (1) and (2) for K gives:
K = P
D
×
(T
A
+ 273
°
C) +
θ
JA
×
(P
D
)
2
(3)
where K is a constant pertaining to the particular part. K can be determined from
equation (3) by measuring P
D
(at equilibrium) for a known T
A
. Using this value of
K, the values of P
D
and T
J
can be obtained by solving equations (1) and (2)
iteratively for any value of T
A
.
Characteristic
Symbol
Value
Unit
Thermal Resistance
Plastic
SOIC
θ
JA
60
60
°
C/W
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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