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參數(shù)資料
| 型號： | XPC750EC |
| 英文描述： | XPC750P/D XPC750P RISC Microprocessor Hardware Specifications |
| 中文描述： | XPC750P /數(shù)XPC750P RISC微處理器硬件規(guī)格 |
| 文件頁數(shù)： | 41/52頁 |
| 文件大?。?/td> | 1274K |
| 代理商： | XPC750EC |
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MOTOROLA
MPC755 RISC Microprocessor Hardware Specifications
41
System Design Information
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
The Bergquist Company
18930 West 78
th
St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 0307
Internet: www.wakefield.com
408-749-7601
800-347-4572
818-842-7277
800-522-6752
603-635-5102
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.8.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 4, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Figure 26 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the heat sink attach material and the heat sink conduction/convective
thermal resistances are the dominant terms.
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