參數(shù)資料
型號： XPC750EC
英文描述： XPC750P/D XPC750P RISC Microprocessor Hardware Specifications
中文描述： XPC750P /數(shù)XPC750P RISC微處理器硬件規(guī)格
文件頁數(shù)： 8/52頁
文件大小： 1274K
代理商： XPC750EC
8
MPC755 RISC Microprocessor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
Table 3 provides the recommended operating conditions for the MPC755.
Table 4 provides the package thermal characteristics for the MPC755 and MPC745. The MPC755 was
initially sampled in a CBGA package, but production units are currently provided in both a CBGA and a
PBGA package. Because of the better long-term device-to-board interconnect reliability of the PBGA
package, Motorola recommends use of a PBGA package except where circumstances dictate use of a CBGA
package. The MPC745 is offered in a PBGA package only.
Table 3. Recommended Operating Conditions
1
Characteristic
Symbol
Recommended Value
Unit
Notes
300 MHz, 350 MHz
400 MHz, 450 MHz
Min
Max
Min
Max
Core supply voltage
V
DD
1.80
2.10
1.90
2.10
V
3
PLL supply voltage
AV
DD
1.80
2.10
1.90
2.10
V
3
L2 DLL supply voltage
L2AV
DD
1.80
2.10
1.90
2.10
V
3
Processor bus
supply voltage
BVSEL = 1
OV
DD
2.375
2.625
2.375
2.625
V
2, 4
3.135
3.465
3.135
3.465
5
L2 bus supply
voltage
L2VSEL = 1
L2OV
DD
2.375
2.625
2.375
2.625
V
2, 4
3.135
3.465
3.135
3.465
5
Input voltage
Processor bus
V
in
GND
OV
DD
GND
OV
DD
V
L2 bus
V
in
GND
L2OV
DD
GND
L2OV
DD
V
JTAG signals
V
in
GND
OV
DD
GND
OV
DD
V
Die-junction temperature
T
j
0
105
0
105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support. For more information, refer to
Section 1.10.2, “Part Numbers Not Fully Addressed by This Document.”
3. 2.0 V nominal.
4. 2.5 V nominal.
5. 3.3 V nominal.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
MPC755
CBGA
MPC755
PBGA
MPC745
PBGA
Junction-to-ambient thermal resistance,
natural convection
R
θ
JA
24
31
34
°C/W
1, 2
Junction-to-ambient thermal resistance,
natural convection, four-layer (2s2p) board
R
θ
JMA
17
25
26
°C/W
1, 3
Junction-to-ambient thermal resistance,
200 ft/min airflow, single-layer (1s) board
R
θ
JMA
18
25
27
°C/W
1, 3
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