參數(shù)資料
型號(hào): XPC750EC
英文描述: XPC750P/D XPC750P RISC Microprocessor Hardware Specifications
中文描述: XPC750P /數(shù)XPC750P RISC微處理器硬件規(guī)格
文件頁(yè)數(shù): 5/52頁(yè)
文件大?。?/td> 1274K
代理商: XPC750EC
MOTOROLA
MPC755 RISC Microprocessor Hardware Specifications
5
General Parameters
— Selectable interface voltages of 2.5 and 3.3 V
— Parity checking on both L2 address and data
Memory management unit
— 128-entry, two-way set-associative instruction TLB
— 128-entry, two-way set-associative data TLB
— Hardware reload for TLBs
— Hardware or optional software tablewalk support
— Eight instruction BATs and eight data BATs
— Eight SPRGs, for assistance with software tablewalks
— Virtual memory support for up to 4 exabytes (2
52
) of virtual memory
— Real memory support for up to 4 gigabytes (2
32
) of physical memory
Bus interface
— Compatible with 60x processor interface
— 32-bit address bus
— 64-bit data bus, 32-bit mode selectable
— Bus-to-core frequency multipliers of 2x, 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x, 7x, 7.5x, 8x,
10x supported
— Selectable interface voltages of 2.5 and 3.3 V
— Parity checking on both address and data buses
Power management
— Low-power design with thermal requirements very similar to MPC740/750
— Three static power saving modes: doze, nap, and sleep
— Dynamic power management
Integrated thermal management assist unit
— On-chip thermal sensor and control logic
— Thermal management interrupt for software regulation of junction temperature
Testability
— LSSD scan design
— IEEE 1149.1 JTAG interface
1.3
General Parameters
The following list provides a summary of the general parameters of the MPC755:
Technology
0.22 μm CMOS, six-layer metal
Die size
6.61 mm
×
7.73 mm (51 mm
2
)
Transistor count
6.75 million
Logic design
Fully-static
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