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參數(shù)資料
| 型號： | μPDPD30101 |
| 廠商： | NEC Corp. |
| 英文描述： | 64-Bit Micro[rocessor(64位微處理器) |
| 中文描述： | 64位微[rocessor（64位微處理器） |
| 文件頁數(shù)： | 94/97頁 |
| 文件大?。?/td> | 409K |
| 代理商： | ΜPDPD30101 |
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μ
PD30101
93
22. RECOMMENDED SOLDERING CONDITIONS
This
μ
PD30101 should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Table 22-1. Surface Mounting Type Soldering Conditions
Soldering Method
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Twice max., Time limit: 3 days
Note
(thereafter 10 to 72 hours
prebaking required at 125 °C)
<Precaution>
Products cannot be baked while packed in anything other than in a heat resistant
tray (i.e. they cannot be baked in a magazine, taping, or heat-labile tray).
IR35-103-2
VPS
Package peak temperature: 215 °C, Duration: 25 to 40 sec. max. (at 200 °C or
above), Number of times: Twice max., Time limit: 3 days
Note
(thereafter 10 to
72 hours prebaking required at 125 °C)
<Precaution>
Products cannot be baked while packed in anything other than in a heat resistant
tray (i.e. they cannot be baked in a magazine, taping, or heat-labile tray).
VP15-103-2
Partial heating
Pin temperature: 300 °C max., Duration: 3 sec. max. (per device side)
—
Note
For the storage period after dry-pack decapsulation, storage conditions are max. 25°C, 65 % RH.
Caution Use of more than one soldering method should be avoided (except in the case of partial heating).
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