參數(shù)資料
型號： 20736
英文描述： Enhanced Am486DX Family Data Sheet? 1.87MB (PDF)
中文描述： 增強Am486DX系列數(shù)據(jù)手冊？ 1.87MB（PDF格式）
文件頁數(shù)： 64/66頁
文件大?。?/td> 1923K
代理商： 20736
64
Enhanced Am486DX Microprocessor Family
P R E L I M I N A R Y
12
The Enhanced Am486DX microprocessors are speci-
fied for operation when T
CASE
(the case temperature) is
within the range of 0
°
C to +85
°
C. T
CASE
can be measured
in any environment to determine whether the Enhanced
Am486DX microprocessors are within specified operat-
ing range. The case temperature should be measured
at the center of the top surface opposite the pins.
PACKAGE THERMAL SPECIFICATIONS
The ambient temperature (T
A
) is guaranteed as long as
T
CASE
is not violated. The ambient temperature can be
calculated from
θ
JC
and
θ
JA
and from these equations:
T
J
= T
CASE
+ P
θ
JC
T
A
= T
J
– P
θ
JA
T
CASE
= T
A
+ P [
θ
JA
–
θ
JC
]
where:
T
J
, T
A
, T
CASE
θ
JC
,
θ
JA
= Junction, Ambient, and Case Temperature
= Junction-to-Case and Junction-to-Ambient
Thermal Resistance, respectively
= Maximum Power Consumption
P
The values for
θ
JA
and
θ
JC
are given in Table 23 for the
1.75 sq. in., 168-pin, ceramic PGA. For the 208-pin
SQFP plastic package,
θ
JA
= 14.0 and
θ
JC
= 1.5.
Table 24 and Table 25 show the T
A
allowable (without
exceeding T
CASE
of 85
°
C and 100
°
C, respectively) at
various airflows and operating frequencies (Clock). Note
that T
A
is greatly improved by attaching fins or a heat
sink to the package. P (the maximum power consump-
tion) is calculated by using the maximum I
CC
at 3.3 V as
tabulated in the DC Characteristics
Note:
*0.350
″
high unidirectional heat sink (Al alloy 6063-T5, 40 mil fin width, 155 mil center-to-center fin spacing)
Table 23. Thermal Resistance (°C/W)
θ
JC
and
θ
JA
for the Enhanced Am486DX CPU in 168-Pin PGA Package
Cooling
Mechanism
θ
JC
θ
JA
vs. Airflow-Linear ft/min. (m/sec)
400
(2.03)
12.0
5.0
4.2
0
(0)
16.5
12.0
5.0
200
(1.01)
14.0
7.0
4.6
600
(3.04)
10.5
4.0
3.8
800
(4.06)
9.5
3.5
3.5
1000
(5.07)
9.0
3.25
3.25
No Heat Sink
Heat Sink*
Heat Sink* and fan
1.5
2.0
2.0
Table 24. Maximum T
A
at Various Airflows in
°
C for Commercial Temperatures (85
°
C)
T
A
by Cooling Type
Clock
PGA: Airflow- ft/Min (m/sec)
400 (2.03)
600 (3.04)
52.7
75.8
78.2
60.7
78.1
79.9
69.0
80.4
81.6
SQFP: No
Airflow
0 (0)
38.9
54.3
75.8
50.4
61.9
78.1
62.1
69.8
80.4
200 (1.01)
46.6
69.6
77.0
56.1
73.5
79.0
65.9
77.4
81.0
800 (4.06)
60.4
80.4
80.4
66.5
81.5
81.5
72.8
82.7
82.7
1000 (5.07)
62.0
81.2
81.2
67.7
82.1
82.1
73.6
83.1
83.1
T
A
without Heat Sink
T
A
with Heat Sink
T
A
with Heat Sink and Fan
T
A
without Heat Sink
T
A
with Heat Sink
T
A
with Heat Sink and Fan
T
A
without Heat Sink
T
A
with Heat Sink
T
A
with Heat Sink and Fan
133 MHz
133 MHz
133 MHz
100 MHz
100 MHz
100 MHz
66 MHz
66 MHz
66 MHz
57.3
78.9
79.5
64.2
80.4
80.8
71.3
82.0
82.3
45
66
82
55
71
83
65
75
83
Table 25. Maximum T
A
at Various Airflows in
°
C for Industrial Temperatures (100
°
C)
T
A
by Cooling Type
Clock
PGA: Airflow- ft/Min (m/sec)
400 (2.03)
600 (3.04)
75.7
93.1
94.9
84
95.4
96.6
SQFP: No
Airflow
0 (0)
65.4
76.9
93.1
77.1
84.8
95.4
200 (1.01)
71.1
88.5
94
80.9
92.4
96
800 (4.06)
81.5
96.5
96.5
87.8
97.7
97.7
1000 (5.07)
82.7
97.1
97.1
88.6
98.1
98.1
T
A
without Heat Sink
T
A
with Heat Sink
T
A
with Heat Sink and Fan
T
A
without Heat Sink
T
A
with Heat Sink
T
A
with Heat Sink and Fan
100 MHz
100 MHz
100 MHz
66 MHz
66 MHz
66 MHz
79.2
95.4
95.8
86.3
97
97.3
70
86
98
80
90
98
相關(guān)PDF資料
PDF描述
2075 data delay devices
208-501-21-38 LED TELEFONSOCKEL T6.8 12V ROT
208-521-21-38 LED TELEFONSOCKEL T6.8 12V GELB
208-532-21-38 LED TELEFONSOCKEL T6.8 12V GRUEN
208-930-21-38 LED TELEFONSOCKEL T6.8 12V BLAU
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
207360-1 功能描述:管腳和插座連接器 3P PLUG HOUSING RoHS:否 制造商:Molex 系列:1561 產(chǎn)品類型:Contacts 觸點類型:Socket (Female) 節(jié)距: 位置/觸點數(shù)量: 排數(shù): 安裝風(fēng)格:Wire 端接類型:Crimp 外殼材料: 觸點材料:Brass 觸點電鍍:Tin 電壓額定值: 電流額定值:
20-7360-10 功能描述:IC 與器件插座 ELEVATOR STRIP LINE 20 PINS RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
207363-000 制造商:TE Connectivity 功能描述:MTC50-YH2-004
207365-1 功能描述:管腳和插座連接器 PIN HDR ASSY METRIMATE 3P RoHS:否 制造商:Molex 系列:1561 產(chǎn)品類型:Contacts 觸點類型:Socket (Female) 節(jié)距: 位置/觸點數(shù)量: 排數(shù): 安裝風(fēng)格:Wire 端接類型:Crimp 外殼材料: 觸點材料:Brass 觸點電鍍:Tin 電壓額定值: 電流額定值:
207365-3 功能描述:管腳和插座連接器 PIN HEADER 3P RoHS:否 制造商:Molex 系列:1561 產(chǎn)品類型:Contacts 觸點類型:Socket (Female) 節(jié)距: 位置/觸點數(shù)量: 排數(shù): 安裝風(fēng)格:Wire 端接類型:Crimp 外殼材料: 觸點材料:Brass 觸點電鍍:Tin 電壓額定值: 電流額定值:
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*