Electrical Characteristics Absolute Maximum Ratings Note (1): These ratings are those which if exceeded may cause permanent damag" />
參數(shù)資料
型號： BBT3821-JH
廠商： Intersil
文件頁數(shù)： 57/75頁
文件大?。?/td> 0K
描述： IC RE-TIMER OCTAL 192-BGA
標準包裝： 90
類型： 時鐘和數(shù)據(jù)恢復(fù)（CDR），多路復(fù)用器
PLL： 無
輸入： CML
輸出： CML，CMOS
電路數(shù)： 1
比率 - 輸入:輸出： 8:8
差分 - 輸入:輸出： 是/是
頻率 - 最大： 3.1875Gbps
電源電壓： 1.425 V ~ 2.5 V
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 192-EBGA
供應(yīng)商設(shè)備封裝： 192-EBGA-B（17x17）
包裝： 托盤
60
Electrical Characteristics
Absolute Maximum Ratings
Note (1): These ratings are those which if exceeded may cause permanent damage to the device. Operation at these or any other conditions in excess of those listed
under Operating Conditions below is not implied. Continued exposure to these ratings may reduce device reliability.
Operating Conditions
All Standard Device specifications assume TC = 0°C to +85°C, VDDAC = VDDAV = VDD = VDDA = 1.5V ± 5%, VDDPR = VDD or 2.4V ± 0.1V, unless
otherwise specified.
The Low Power Device specifications assume TC = 0°C to +85°C, VDDAC = VDDAV = VDD = VDDA = 1.355V ± 4%, VDDPR = VDD or 2.4V ± 0.1V,
unless otherwise specified.
Note (1): The VDDPR supply should be tied to a level at or above VDD, and at the highest level expected on any “2.5V tolerant” control pin, consistent with the above
ratings.
Note (2): For reference only. All testing is performed based on Case Temperature.
Note (1): The ‘Max’ value is at the maximum supply voltages, while the ‘Typ’ value is at the nominal supply voltages. The power dissipation is not significantly affected
by the VDDPR supply (see Table 111 for the distribution of power between the supplies).
Note (2): The operating power varies slightly with the data pattern. The part is tested using a PRBS23 pattern.
Table 102. ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN
MAX
UNITS
VDDPR
2.5V Protection Power Supply Voltage
-0.5,
VDD - 0.5
2.6,
VDD + 2.0
V
VDDA, VDD, VDDAC,
VDDAV
All Other Power Supply Voltages
-0.5
1.65
V
V INCML
CML DC Input Voltage
-0.5
VDD + 0.5
V
IOUTCML
CML Output Current
- 50
+50
mA
V INCMS1
1.2V CMOS Input Voltage
-0.5
VDD + 0.5
V
V INCMS2
1.5V CMOS Input Voltage
-0.5
VDD + 0.5
V
V INCMS3
2.5V Tolerant CMOS Input Voltage
-0.5
2.6
V
Tstg
Storage Temperature
- 55
125
°C
Tj
Junction Temperature
- 55
125
°C
TSOL
Soldering Temperature (10s)
220
°C
V ESD
Maximum Input ESD (HBM)
-2000
2000
V
Table 103. RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
MIN
NOM
MAX
UNITS
VDDA VDDAV,
VDDAC & VDD
Core and Serial I/O Power Supply
Voltages
(Standard Device)
1.425
1.5
1.575
V
(Low Power Device)
1.300
1.355
1.410
V
VDDPR
Control I/O Protection Power Supply Voltage
VDD
(1)
2.5
V
TA
Ambient Operating Temperature(2)
025
+70
°C
TC
Case Operating Temperature
0
+85
°C
Table 104. POWER DISSIPATION AND THERMAL RESISTANCE
SYMBOL
PARAMETER
TYP(1)
MAX(1)
UNITS
PD
Power Dissipation(2)
(Standard Device)
1650
1830
mW
(Low Power Device)
1350
1475
mW
θJC
Thermal Resistance, Junction to Case
2.0
°C/W
θCA
Thermal Resistance, Case to Ambient (still air, gap filler & cold plate)
13.0
°C/W
θCA
Thermal Resistance, Case to Ambient (still air only)
31.0
°C/W
BBT3821
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