參數(shù)資料
型號(hào)： MT29F4G08BABWP
元件分類(lèi)： PROM
英文描述： 512M X 8 FLASH 2.7V PROM, 18 ns, PDSO48
封裝： LEAD FREE, TSOP1-48
文件頁(yè)數(shù)： 55/57頁(yè)
文件大?。?/td> 1057K
代理商： MT29F4G08BABWP
PDF: 09005aef818a56a7 / Source: 09005aef81590bdd
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2gb_nand_m29b__2.fm - Rev. I 1/06 EN
7
2004 Micron Technology, Inc. All rights reserved.
2, 4, 8Gb: x8/x16 Multiplexed NAND Flash Memory
General Description
NAND technology provides a cost-effective solution for applications requiring high-
density solid-state storage. The MT29F2G08AxB and MT29F2G16AxB are 2Gb NAND
Flash memory devices. The MT29F4G08BxB and MT29F4G16BxB are two-die stacks that
operate as a single 4Gb device. The MT29F8G08FAB is a four-die stack that operates as
two independent 4Gb devices (MT29F4G08BxB), providing a total storage capacity of
8Gb in a single, space-saving package. Micron NAND Flash devices include standard
NAND features as well as new features designed to enhance system-level performance.
Micron NAND Flash devices use a highly multiplexed 8- or 16-bit bus (I/O[7:0] or
I/O[15:0]) to transfer data, addresses, and instructions. The five command pins (CLE,
ALE, CE#, RE#, WE#) implement the NAND command bus interface protocol. Three
additional pins control hardware write protection (WP#), monitor device status (R/B#),
and initiate the auto-read feature (PRE—3V device only). Note that the PRE function is
not supported on extended-temperature devices.
This hardware interface creates a low-pin-count device with a standard pinout that is
the same from one density to another, allowing future upgrades to higher densities with-
out board redesign.
MT29F2G and MT29F4G devices contain 2,048 and 4,096 erasable blocks respectively.
Each block is subdivided into 64 programmable pages. Each page consists of 2,112 bytes
(x8) or 1,056 words (x16). The pages are further divided into a 2,048-byte data storage
region with a separate 64-byte area on the x8 device; and on the x16 device, separate
1,024-word and 32-word areas. The 64-byte and 32-word areas are typically used for
error management functions.
The contents of each 2,112-byte page can be programmed in 300s, and an entire 132K-
byte/66K word block can be erased in 2ms. On-chip control logic automates PROGRAM
and ERASE operations to maximize cycle endurance. ERASE/PROGRAM endurance is
specified at 100,000 cycles when using appropriate error correcting code (ECC) and
error management.
相關(guān)PDF資料
PDF描述
MT36JSZF51272PDY-1G6XX 512M X 72 DDR DRAM MODULE, DMA240
MT3S04AU UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR
MT41J512M4JE-187EIT:A 64M X 4 DDR DRAM, PBGA82
MT42C8255RG-7TR 256K X 8 VIDEO DRAM, 70 ns, PDSO40
MT46V32M16TG-75ELIT 32M X 16 DDR DRAM, 0.75 ns, PDSO66
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MT29F4G08BABWP-ET 功能描述:IC FLASH 4GBIT 48TSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類(lèi)型:SDRAM 存儲(chǔ)容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:托盤(pán) 其它名稱(chēng):Q2841869
MT29F4G08BABWP-ET TR 功能描述:IC FLASH 4GBIT 48TSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類(lèi)型:SDRAM 存儲(chǔ)容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:托盤(pán) 其它名稱(chēng):Q2841869
MT29F4G08BBBWP 功能描述:IC FLASH 4GBIT 48TSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類(lèi)型:SDRAM 存儲(chǔ)容量:256M（8Mx32） 速度:143MHz 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:托盤(pán) 其它名稱(chēng):Q2841869
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*